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The volumes XI, XII and XIII examine the physical and technical foundation for recent progress in applied scanning probe techniques. The first volume came out in January 2004, the second to fourth volumes in early 2006 and the fifth to seventh volumes in late 2006. The field is progressing so fast that there is a need for a set of volumes every 12 to 18 months to capture latest developments. These volumes constitute a timely comprehensive overview of SPM applications. After introducing scanning probe microscopy, including sensor technology and tip characterization, chapters on use in various industrial applications are presented. Industrial applications span topographic and dynamical surface studies of thin-film semiconductors, polymers, paper, ceramics, and magnetic and biological materials. The chapters have been written by leading researchers and application scientists from all over the world and from various industries to provide a broader perspective.
The volumes XI, XII and XIII examine the physical and technical foundation for recent progress in applied scanning probe techniques. These volumes constitute a timely comprehensive overview of SPM applications. Real industrial applications are included.
This volume contains two-page abstracts of the 482 papers presented at the latest conference on the subject, in Alexandroupolis, Greece. The accompanying CD contains the full length papers. The abstracts of the fifteen plenary lectures are included at the beginning of the book. The remaining 467 abstracts are arranged in 23 tracks and 28 special symposia/sessions with 225 and 242 abstracts, respectively. The papers of the tracks have been contributed from open call, while the papers of the symposia/sessions have been solicited by the respective organizers.
Nanoscale and nanostructured materials have exhibited different physical properties from the corresponding macroscopic coarse-grained materials due to the size confinement. As a result, there is a need for new techniques to probe the mechanical behavior of advanced materials on the small scales. Micro and Nano Mechanical Testing of Materials and Devices presents the latest advances in the techniques of mechanical testing on the micro- and nanoscales, which are necessary for characterizing the mechanical properties of low-dimensional materials and structures. Written by a group of internationally recognized authors, this book covers topics such as: Techniques for micro- and nano- mechanical characterization; Size effects in the indentation plasticity; Characterization of low-dimensional structure including nanobelts and nanotubes; Characterization of smart materials, including piezoelectric materials and shape memory alloys; Analysis and modeling of the deformation of carbon-nanotubes. Micro and Nano Mechanical Testing of Materials and Devices is a valuable resource for engineers and researchers working in the area of mechanical characterization of advanced materials.
The field of Experimental Mechanics has evolved substantially over the past 100 years. In the early years, the field was primarily comprised of applied physicists, civil engineers, railroad engineers, and mechanical engineers. The field defined itself by those who invented, developed, and refined experimental tools and techniques, based on the latest technologies available, to better understand the fundamental mechanics of materials and structures used to design many aspects of our everyday life. What the early experimental mechanician measured, observed, and evaluated were things like stress, strain, fracture, and fatigue, to name a few, which remain fundamental to the field today. This boo...
Purdue University has played a leading role in providing the engineers who designed, built, tested, and flew the many aircraft and spacecraft that so changed human progress during the 20th century. It is estimated that Purdue has awarded 6% of all BS degrees in aerospace engineering, and 7% of all PhDs in the United States during the past 65 years. The University's alumni have led significant advances in research and development of aerospace technology, have headed major aerospace corporations and government agencies, and have established an amazing record for exploration of space. More than one third of all US manned space flights have had at least one crew member who was a Purdue engineering graduate (including the first and last men to step foot on the moon). The School of Aeronautics & Astronautics was founded as a separate school within the College of Engineering at Purdue University in 1945. The first edition of this book was published in 1995, at the time of the school's 50th anniversary. This corrected and expanded second edition brings the school's illustrious history up to date, and looks to Purdue's future in the sky and in space.
Crack initiation and growth are key issues when it comes to the mechanical reliab- ity of microelectronic devices and microelectromechanical systems (MEMS). Es- cially in organic electronics where exible substrates will play a major role these issues will become of utmost importance. It is therefore necessary to develop me- ods which in situ allow the experimental investigation of surface deformation and fracture processes in thin layers at a micro and nanometer scale. While scanning electron microscopy (SEM) might be used it is also associated with some major experimental drawbacks. First of all if polymers are investigated they usually have to be coated with a metal layer due to their comm...
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The first volume in the series was released in January 2004 and the second to fourth volumes in early 2006. The field is now progressing so fast that there is a need for one volume every 12 to 18 months to capture latest developments. Volume VI presents 10 chapters on a variety of new and emerging techniques and refinements of SPM applications.
This proceedings book brings together 55 papers on ceramic armor presented by authorities from around the world covering topics such as ceramic armor development, processing, manufacturing, and insertion. This book will be of great interest to armor researchers in university, industry and government laboratories as well as those industries involved in ceramic armor and high performance structural ceramics. Papers were presented at PacRim IV, An International Conference on Advanced Ceramics and Glasses, Wailea, Maui, Hawaii, USA (2001). 650 pages.