Welcome to our book review site go-pdf.online!
You may have to Search all our reviewed books and magazines, click the sign up button below to create a free account.
Micro Process Engineering, 3 Volume Set
This three-volume handbook provides an overview of the key aspects of micro process engineering. Volume 1 covers the fundamentals, operations and catalysts, volume 2 examines devices, reactions and applications, with volume 3 rounding off the trilogy with system, process and plant engineering. Fluid dynamics, mixing, heat/mass transfer, purification and separation microstructured devices and microstructured reactors are explained in the first volume. Volume 2 segments microreactor design, fabrication and assembly, bulk and fine chemistry, polymerisation, fuel processing and functional materials into understandable parts. The final volume of the handbook addresses microreactor systems design and scale-up, sensing, analysis and control, chemical process engineering, economic and eco-efficiency analyses as well as microreactor plant case studies in one book. Together, this 3-volume handbook explains the science behind micro process engineering to the scale-up and their real life industrial applications.
Thin Film Processes II
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. - Provides an all-new sequel to the 1978 classic, Thin Film Processes - Introduces new topics, and several key topics presented in the original volume are updated - Emphasizes practical applications of major thin film deposition and etching processes - Helps readers find the appropriate technology for a particular application
Dynamics and Control of Chemical Reactors, Distillation Columns and Batch Processes (DYCORD+ '92)
In addition to the three main themes: chemical reactors, distillation columns, and batch processes this volume also addresses some of the new trends in dynamics and control methodology such as model based predictive control, new methods for identification of dynamic models, nonlinear control theory and the application of neural networks to identification and control. Provides a useful reference source of the major advances in the field.
Silicon Epitaxy
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded.
Flow Chemistry
In flow chemistry reactions are performed in a reactor with the reactants pumped through it. It has the benefit of being easily scaled up and it is straightforward to integrate synthesis, workup and analysis into one system. This volume provides an update on recent advances in the field of flow chemistry, with special emphasis on new, integrated approaches for green and efficient chemistry. This book is a valuable resource for researchers in green chemistry, chemical engineers and Industrial chemists working in the pharmaceutical and fine chemicals industries.
CVD XV
None
Machine Learning and Hybrid Modelling for Reaction Engineering
Over the last decade, there has been a significant shift from traditional mechanistic and empirical modelling into statistical and data-driven modelling for applications in reaction engineering. In particular, the integration of machine learning and first-principle models has demonstrated significant potential and success in the discovery of (bio)chemical kinetics, prediction and optimisation of complex reactions, and scale-up of industrial reactors. Summarising the latest research and illustrating the current frontiers in applications of hybrid modelling for chemical and biochemical reaction engineering, Machine Learning and Hybrid Modelling for Reaction Engineering fills a gap in the methodology development of hybrid models. With a systematic explanation of the fundamental theory of hybrid model construction, time-varying parameter estimation, model structure identification and uncertainty analysis, this book is a great resource for both chemical engineers looking to use the latest computational techniques in their research and computational chemists interested in new applications for their work.
Advances in Rapid Thermal and Integrated Processing
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
