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Chemical Mechanical Planarization in IC Device Manufacturing III
This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).
Fundamentals of Microelectronics
Fundamentals of Microelectronics, 2nd Edition is designed to build a strong foundation in both design and analysis of electronic circuits this text offers conceptual understanding and mastery of the material by using modern examples to motivate and prepare readers for advanced courses and their careers. The books unique problem-solving framework enables readers to deconstruct complex problems into components that they are familiar with which builds the confidence and intuitive skills needed for success.
Advances in Chemical-Mechanical Polishing: Volume 816
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
Chemical-Mechanical Planarization: Volume 767
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
