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Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations...
Design Automation Methods and Tools for Microfluidics-Based Biochips deals with all aspects of design automation for microfluidics-based biochips. Experts have contributed chapters on many aspects of biochip design automation. Topics covered include: device modeling; adaptation of bioassays for on-chip implementations; numerical methods and simulation tools; architectural synthesis, scheduling and binding of assay operations; physical design and module placement; fault modeling and testing; and reconfiguration methods.
This book constitutes selected papers from the Second International Conference on Microelectronic Devices, Circuits and Systems, ICMDCS 2021, held in Vellore, India, in February 2021. The 32 full papers and 6 short papers presented were thoroughly reviewed and selected from 103 submissions. They are organized in the topical sections on digital design for signal, image and video processing; VLSI testing and verification; emerging technologies and IoT; nano-scale modelling and process technology device; analog and mixed signal design; communication technologies and circuits; technology and modelling for micro electronic devices; electronics for green technology.
This book constitutes the refereed proceedings of the 17th International Symposium on Algorithms and Computation, ISAAC 2006, held in Kolkata, India, December 2006. The 73 revised full papers cover algorithms and data structures, online algorithms, approximation algorithm, computational geometry, computational complexity, optimization and biology, combinatorial optimization and quantum computing, as well as distributed computing and cryptography.
The refereed proceedings of the International Central and Eastern European Conference on Multi-Agent Systems, CEEMAS 2003, held in Prague, Czech Republic, in June 2003. The 58 revised full papers presented together with 3 invited contributions were carefully reviewed and selected from 109 submissions. The papers are organized in topical sections on formal methods, social knowledge and meta-reasoning, negotiation, and policies, ontologies and languages, planning, coalitions, evolution and emergent behaviour, platforms, protocols, security, real-time and synchronization, industrial applications, e-business and virtual enterprises, and Web and mobile agents.
This groundbreaking book provides you with a comprehensive understanding of FBAR (thin-film bulk acoustic wave resonator), MEMS (microelectomechanical system), and NEMS (nanoelectromechanical system) resonators. For the first time anywhere, you find extensive coverage of these devices at both the technology and application levels. This practical reference offers you guidance in design, fabrication, and characterization of FBARs, MEMS and NEBS. It discusses the integration of these devices with standard CMOS (complementary-metal-oxide-semiconductor) technologies, and their application to sensing and RF systems. Moreover, this one-stop resource looks at the main characteristics, differences, and limitations of FBAR, MEMS, and NEMS devices, helping you to choose the right approaches for your projects. Over 280 illustrations and more than 130 equations support key topics throughout the book.
Presenting the cutting-edge results of new device developments and circuit implementations, High-Speed Devices and Circuits with THz Applications covers the recent advancements of nano devices for terahertz (THz) applications and the latest high-speed data rate connectivity technologies from system design to integrated circuit (IC) design, providing relevant standard activities and technical specifications. Featuring the contributions of leading experts from industry and academia, this pivotal work: Discusses THz sensing and imaging devices based on nano devices and materials Describes silicon on insulator (SOI) multigate nanowire field-effect transistors (FETs) Explains the theory underpinn...