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Carbon Nanotube Based VLSI Interconnects
The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
Through Silicon Vias
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
VLSI Design and Test
This book constitutes the proceedings of the 26th International Symposium on VLSI Design and Test, VDAT 2022, which took place in Jammu, India, in July 2022. The 32 regular papers and 16 short papers presented in this volume were carefully reviewed and selected from 220 submissions. They were organized in topical sections as follows: Devices and Technology; Sensors; Analog/Mixed Signal; Digital Design; Emerging Technologies and Memory; System Design.
VLSI Design and Test
This book constitutes the refereed proceedings of the 23st International Symposium on VLSI Design and Test, VDAT 2019, held in Indore, India, in July 2019. The 63 full papers were carefully reviewed and selected from 199 submissions. The papers are organized in topical sections named: analog and mixed signal design; computing architecture and security; hardware design and optimization; low power VLSI and memory design; device modelling; and hardware implementation.
VLSI Design and Test
This book constitutes the refereed proceedings of the 22st International Symposium on VLSI Design and Test, VDAT 2018, held in Madurai, India, in June 2018. The 39 full papers and 11 short papers presented together with 8 poster papers were carefully reviewed and selected from 231 submissions. The papers are organized in topical sections named: digital design; analog and mixed signal design; hardware security; micro bio-fluidics; VLSI testing; analog circuits and devices; network-on-chip; memory; quantum computing and NoC; sensors and interfaces.
Design of 3D Integrated Circuits and Systems
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power di...
Introduction to Microelectronics to Nanoelectronics
Focussing on micro- and nanoelectronics design and technology, this book provides thorough analysis and demonstration, starting from semiconductor devices to VLSI fabrication, designing (analog and digital), on-chip interconnect modeling culminating with emerging non-silicon/ nano devices. It gives detailed description of both theoretical as well as industry standard HSPICE, Verilog, Cadence simulation based real-time modeling approach with focus on fabrication of bulk and nano-devices. Each chapter of this proposed title starts with a brief introduction of the presented topic and ends with a summary indicating the futuristic aspect including practice questions. Aimed at researchers and seni...
VLSI Design and Test
This book constitutes the refereed proceedings of the 17th International Symposium on VLSI Design and Test, VDAT 2013, held in Jaipur, India, in July 2013. The 44 papers presented were carefully reviewed and selected from 162 submissions. The papers discuss the frontiers of design and test of VLSI components, circuits and systems. They are organized in topical sections on VLSI design, testing and verification, embedded systems, emerging technology.
Nanoscale Semiconductors
This reference text discusses conduction mechanism, structure construction, operation, performance evaluation and applications of nanoscale semiconductor materials and devices in VLSI circuits design. The text explains nano materials, devices, analysis of its design parameters to meet the sub-nano-regime challenges for CMOS devices. It discusses important topics including memory design and testing, fin field-effect transistor (FinFET), tunnel field-effect transistor (TFET) for sensors design, carbon nanotube field-effect transistor (CNTFET) for memory design, nanowire and nanoribbons, nano devices based low-power-circuit design, and microelectromechanical systems (MEMS) design. The book disc...
Nano Interconnects
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understandi...
