Welcome to our book review site go-pdf.online!

You may have to Search all our reviewed books and magazines, click the sign up button below to create a free account.

Sign up

ECE200: Introduction to Signals, Circuits and Systems
  • Language: en
  • Pages: 230

ECE200: Introduction to Signals, Circuits and Systems

This textbook is used in ECE 200: Introduction to Signals, Circuits and Systems offered by the Department of Electrical and Computer Engineering at NC State University. It is intended for sophomores with little or no background in signals and circuits. The first half of the book is dedicated to fundamental concepts and applications of them to analysis of simple circuits. The second half of the book focuses on analog signal processing with examples in practical systems including audio amplifiers, mixers, filters and RF transmitters and receivers. All proceeds from the sales of this book through this page are donated to the Department of Electrical and Computer Engineering to support the ECE200 Laboratory.

Advanced Short-time Thermal Processing for Si-based CMOS Devices 2
  • Language: en
  • Pages: 444
Rapid Thermal Processing
  • Language: en
  • Pages: 441

Rapid Thermal Processing

This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.

Advanced Gate Stack, Source/drain and Channel Engineering for Si-based CMOS 3
  • Language: en
  • Pages: 484

Advanced Gate Stack, Source/drain and Channel Engineering for Si-based CMOS 3

These proceedings describe processing, materials and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.

ULSI Process Integration II
  • Language: en
  • Pages: 636
Official Gazette of the United States Patent and Trademark Office
  • Language: en
  • Pages: 884

Official Gazette of the United States Patent and Trademark Office

  • Type: Book
  • -
  • Published: 1994
  • -
  • Publisher: Unknown

None

Rapid Thermal and Integrated Processing II: Volume 303
  • Language: en
  • Pages: 448

Rapid Thermal and Integrated Processing II: Volume 303

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Rapid Thermal and Integrated Processing
  • Language: en
  • Pages: 914

Rapid Thermal and Integrated Processing

  • Type: Book
  • -
  • Published: 1998
  • -
  • Publisher: Unknown

None

Innovation for Applied Science and Technology
  • Language: en
  • Pages: 3818

Innovation for Applied Science and Technology

Selected, peer reviewed papers from the Second International Conference on Engineering and Technology Innovation 2012, November 2 - 6, 2012, Kaohsiung, Taiwan ROC. The papers are grouped as follows: Chapter 1: Materials Engineering and Processing Technologies of Materials; Chapter 2: Machine Parts and Mechanisms: Design and Manufacturing; Chapter 3: Energy and Power Engineering; Chapter 4: Architecture, Civil and Industrial Engineering; Chapter 5: Environmental Sciences and Engineering; Chapter 6: Medical Machinery and Technologies, Innovative Developments; Chapter 7: Sensors, Mechatronics and Robotics; Chapter 8: Automation and Control; Chapter 9: Electronics, Electrical Engineering and Power Electronics; Chapter 10: Communication, Optoelectronics and Optical Systems; Chapter 11: Methods and Algorithms for Processing and Analysis of Data; Chapter 12: Computer and Information Technologies; Chapter 13: Innovation Management, Product Design and Engineering Management.