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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
  • Language: en
  • Pages: 873

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

Recent Progress in Lead-Free Solder Technology
  • Language: en
  • Pages: 332

Recent Progress in Lead-Free Solder Technology

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Obtaining and Characterization of New Materials
  • Language: en
  • Pages: 270

Obtaining and Characterization of New Materials

  • Type: Book
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  • Published: 2022
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  • Publisher: Unknown

At present, more and more procedures and technologies used to discover and characterize new materials are available, including advanced characterization techniques.This Special Issue covers a wide range of topics about obtaining and characterizing new materials, from the nano to macro scales, including for new alloys, ceramics, composites, biomaterials, and polymers and the procedures and technologies used to enhance their structure, properties, and functions. To select new materials for future use, we must first understand their structure and their characteristics using modern techniques such as microscopy (SEM, TEM, AFM, STM, etc.), spectroscopy (EDX, XRD, XRF, FTIR, XPS, etc.), and mechanical tests (tensile, hardness, elastic modulus, toughness, etc.) and their behaviors (in vitro and in vivo; corrosion; and thermal--DSC, STA, DMA, magnetic properties, and biocompatibility), among many others.

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
  • Language: en
  • Pages: 1044

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

  • Type: Book
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  • Published: 2004-02-27
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  • Publisher: CRC Press

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

A Guide to Lead-free Solders
  • Language: en
  • Pages: 212

A Guide to Lead-free Solders

The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.

Bioorganic Phase in Natural Food: An Overview
  • Language: en
  • Pages: 335

Bioorganic Phase in Natural Food: An Overview

  • Type: Book
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  • Published: 2018-04-20
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  • Publisher: Springer

The focus of this singular work is to discuss the role and importance of bioorganic phase in food products-providing the first major reference source for researchers looking to understand all aspects of the isolation, extraction and application of this major element in natural foods. From the identifying features to its applications through biotechnology and nanobiotechnology, this book covers all of the important aspects of bioorganic phase and points to future uses and methods. With chapters focusing on phase extraction and application, food product synthesis and nanoparticle application, Bioorganic Phase in Natural Food: An Overview covers both conventional and non-conventional approaches for the extraction of bioorganic phase from various food sources. Toxicity studies in nanoparticles are presented, and the vital role played by bioorganic phase toward nanoparticles synthesis is outlined in full. For any researcher looking for complete coverage of all main aspects of bioorganic phase in foods, this work provides a comprehensive and well-researched view of this important subject. .

Surface Mining Technology
  • Language: en
  • Pages: 360

Surface Mining Technology

This book gives a brief history and a general overview of the state of surface mining technology with topics ranging from the principles to surface mining methods, systems, and pit planning design. It starts with the definition of surface mine and ends with land reclamation and mine closure. The following chapters address the basics of mineral economics, calculation of stripping ratio; exploitation of difficult parts of ore deposits, slope stability, controlling falls and slides in the surface mines, sorts of freight traffic, scrapers, bulldozers, and loaders. The book serves as a reference text for mining students, engineers, and geologists.

Fibers for Technical Textiles
  • Language: en
  • Pages: 227

Fibers for Technical Textiles

This book discusses the properties of fibres used in manufacturing technical textiles, highlighting the importance of material selection in terms of cost, end-user requirements and properties. It also discusses the classification of technical textiles, and describes the details of each category, such as the properties, applications, advantages and drawbacks. As such, it is a valuable resource for all those interested in advanced textiles.

Photocatalysis
  • Language: en
  • Pages: 394

Photocatalysis

From environmental remediation to alternative fuels, this book explores the numerous important applications of photocatalysis. The book covers topics such as the photocatalytic processes in the treatment of water and air; the fundamentals of solar photocatalysis; the challenges involved in developing self-cleaning photocatalytic materials; photocatalytic hydrogen generation; photocatalysts in the synthesis of chemicals; and photocatalysis in food packaging and biomedical and medical applications. The book also critically discusses concepts for the future of photocatalysis, providing a fascinating insight for researchers. Together with Photocatalysis: Fundamentals and Perspectives, these volumes provide a complete overview to photocatalysis.

Fundamentals and Details of Laser Welding
  • Language: en
  • Pages: 202

Fundamentals and Details of Laser Welding

This highly illustrated book presents the essential information and major constituents of laser welding, including laser brazing and laser-arc hybrid welding. Students, engineers, researchers, scientists, specialists, professors, consultants, designers, and executives worldwide will fully grasp the fundamentals, the present state, and the applications of laser welding. Welding phenomena, formation mechanisms and preventive procedures of welding defects, and process monitoring and adaptive control are especially emphasized, because understanding these aspects of laser welding greatly improves the performance of work and research and solves many problems in the field. Finally, the book shows how increasingly widespread use of a variety of materials is bringing major advances to laser welding.