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Reversible and DNA Computing
Master the subjects of reversible computing and DNA computing with this expert volume Reversible and DNA Computing offers readers new ideas and technologies in the rapidly developing field of reversible computing. World-renowned researcher and author Hafiz Md. Hasan Babu shows readers the fundamental concepts and ideas necessary to understand reversible computing, including reversible circuits, reversible fault tolerant circuits, and reversible DNA circuits. Reversible and DNA Computing contains a practical approach to understanding energy-efficient DNA computing. In addition to explaining the foundations of reversible circuits, the book covers topics including: Advanced logic design An introduction to the fundamentals of reversible computing Advanced reversible logic synthesis Reversible fault tolerance Fundamentals of DNA computing Reversible DNA logic synthesis DNA logic design This book is perfect for undergraduate and graduate students in the physical sciences and engineering, as well as those working in the field of quantum computing. It belongs on the bookshelves of anyone with even a passing interest in nanotechnology, energy-efficient computing, and DNA computing.
Proceedings of the International Conference on Signal, Networks, Computing, and Systems
The book is a collection of high-quality peer-reviewed research papers presented in the first International Conference on Signal, Networks, Computing, and Systems (ICSNCS 2016) held at Jawaharlal Nehru University, New Delhi, India during February 25–27, 2016. The book is organized in to two volumes and primarily focuses on theory and applications in the broad areas of communication technology, computer science and information security. The book aims to bring together the latest scientific research works of academic scientists, professors, research scholars and students in the areas of signal, networks, computing and systems detailing the practical challenges encountered and the solutions adopted.
Computer Communication, Networking and Internet Security
The book is a compilation of high-quality scientific papers presented at the 3rd International Conference on Computer & Communication Technologies (IC3T 2016). The individual papers address cutting-edge technologies and applications of soft computing, artificial intelligence and communication. In addition, a variety of further topics are discussed, which include data mining, machine intelligence, fuzzy computing, sensor networks, signal and image processing, human-computer interaction, web intelligence, etc. As such, it offers readers a valuable and unique resource.
Field-Coupled Nanocomputing
Field-coupled nanocomputing (FCN) paradigms offer fundamentally new approaches to digital information processing that do not utilize transistors or require charge transport. Information transfer and computation are achieved in FCN via local field interactions between nanoscale building blocks that are organized in patterned arrays. Several FCN paradigms are currently under active investigation, including quantum-dot cellular automata (QCA), molecular quantum cellular automata (MQCA), nanomagnetic logic (NML), and atomic quantum cellular automata (AQCA). Each of these paradigms has a number of unique features that make it attractive as a candidate for post-CMOS nanocomputing, and each faces c...
Edge Analytics
This book constitutes refereed proceedings of the 26th annual International Conference on Advanced Computing and Communications (ADCOM 2020). ADCOM, the flagship Systems Conference of the ACCS, is a major annual international meeting that draws leading scientists and researchers in computational and communications engineering from across industry and academia. The proceedings highlight the growing importance of large-scale systems engineering and discuss leading-edge research and trends. The main theme of ADCOM 2020 is Edge Analytics. The book includes novel contributions and latest developments from researchers across industry and academia who are working in security, privacy, and data analytics from both technological and social perspectives. The book serves as a valuable reference resource for academics and researchers across the globe.
Nano Interconnects
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understandi...
Proceedings of 4th Research Day 2022
Commemorating CBIT’s 43 years of successful Journey in the Field of Technical Education, the Institute has organized the third ‘Research Day’ in the Institute’s Campus on 17 December 2022, by inviting the Research Scholars, Faculty, Students and other scientists from industry and institutions, engaged in research to participate in the proceedings and present their works as abstracts. There has been an overwhelming response not only from CBIT fraternity but also from the research community across India. The meticulously selected Abstracts have been compiled and published as Book of Abstracts showcasing the Research in Progress and the outcomes of the completed Projects. This compilation of Research Abstracts will serve as a source of knowledge and inspiration to the discerning researchers and also enable them to appreciate the challenges in developing the innovate products while showcasing on the present status of the products and their principles of operation undertaken by other Researches, developers and enthusiastic engineers.
Advanced MEMS Packaging
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal design...
