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ULSI Process Integration 6
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Introduction to Image Acquisition and Display Technologies
• Readers will gain an understanding of the optical technology, material science, and semiconductor device technology behind image acquisition devices • Research on image information is stable but slowly growing and several universities globally teach related courses for which this is valuable supplementary reading • This book offers a unique focus on the devices used in image sensors and displays
Full-Spectrum Responsive Photocatalytic Materials
Full-Spectrum Responsive Photocatalytic Materials: From Fundamentals to Applications provides a comprehensive overview on the design, synthesis concepts, mechanisms, characterization techniques, and advances and limitations in applications of full-spectrum responsive photocatalytic materials. The book starts with the fundamentals of full-spectrum responsive materials. It then discusses the problems of most semiconductors that are not active in the whole solar spectrum and explains the benefits of utilizing full-spectrum responsive photocatalysts. Other sections describe examples of full-spectrum responsive photocatalysts classified by material types and provide the design principles and char...
New Publications
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Thin Film Transistors 9 (TFT 9)
This issue of ECS Transactions includes all aspects of fabrication processes, materials, devices, and applications related to TFTs.
Minerals Today
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