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Electrocrystallization in Nanotechnology
  • Language: en
  • Pages: 279

Electrocrystallization in Nanotechnology

Here, the well-known editor in the field of electrocrystallization and his team of excellent international authors guarantee the high quality of the contributions. Clearly structured in two main parts, this book reviews the fundamentals and applications of electrocrystallization processes in nanotechnology. The first part, "Fundamentals" covers the basic concepts of electrocrystallization, computer simulations of low-dimensional metal phase formation, electrodeposition in templates and nanocavities, nanoscale electrocrystallization from ionic liquids, and superconformal electrodeposition of metals. The second part, "Preparation and properties of nanostructures", includes nanostructuring by STM tip induced localized electrocrystallization of metals, fabrication of ordered anodic nanoporous Al2O3 layers and their application, preparation of nanogaps, nanocontacts, nanowires and nanodots by selective electrochemical deposition, as well as electrodeposition of magnetic nanostructures and multilayers

Advanced Interconnects for ULSI Technology
  • Language: en
  • Pages: 616

Advanced Interconnects for ULSI Technology

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects,...

Physics, Chemistry and Applications of Nanostructures
  • Language: en
  • Pages: 668

Physics, Chemistry and Applications of Nanostructures

This book presents invited reviews and original short notes of recent results obtained in studies concerning the fabrication and application of nanostructures, which hold great promise for the next generation of electronic, optoelectronic and energy conversion devices. Covering exciting and relatively new topics such as fast-progressing nanoelectronics and optoelectronics, molecular electronics and spintronics, nanophotonics, nanosensorics and nanoenergetics as well as nanotechnology and quantum processing of information, this book gives readers a more complete understanding of the practical uses of nanotechnology and nanostructures. Contents:Physics of NanostructuresNanoelectromagneticsChem...

Physics, Chemistry and Application of Nanostructures
  • Language: en
  • Pages: 667

Physics, Chemistry and Application of Nanostructures

This book presents invited reviews and original short notes of recent results obtained in studies concerning the fabrication and application of nanostructures, which hold great promise for the next generation of electronic, optoelectronic and energy conversion devices. Covering exciting and relatively new topics such as fast-progressing nanoelectronics and optoelectronics, molecular electronics and spintronics, nanophotonics, nanosensorics and nanoenergetics as well as nanotechnology and quantum processing of information, this book gives readers a more complete understanding of the practical uses of nanotechnology and nanostructures.

Processing, Materials, and Integration of Damascene and 3D Interconnects
  • Language: en
  • Pages: 171

Processing, Materials, and Integration of Damascene and 3D Interconnects

This issue focuses on recent advances in damascene interconnects and 3D interconnects.

Electronics and 3-D Packaging 4
  • Language: en
  • Pages: 63

Electronics and 3-D Packaging 4

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Electronics and 3D Packaging 4¿ held during the 218th meeting of The Electrochemical Society, in Las Vegas, Nevada, from October 10 to 15, 2010.

Electronics Packaging 3
  • Language: en
  • Pages: 121

Electronics Packaging 3

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Electronics Packaging 3¿, held during the PRiME 2008 joint international meeting of The Electrochemical Society and The Electrochemical Society of Japan, with the technical cosponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry. This meeting was held in Honolulu, Hawaii, from October 12 to 17, 2008.

Metal-semiconductor Interfaces
  • Language: en
  • Pages: 422

Metal-semiconductor Interfaces

  • Type: Book
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  • Published: 1995
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  • Publisher: IOS Press

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Cleaning Technology in Semiconductor Device Manufacturing
  • Language: en
  • Pages: 636