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Approximate Circuits
This book provides readers with a comprehensive, state-of-the-art overview of approximate computing, enabling the design trade-off of accuracy for achieving better power/performance efficiencies, through the simplification of underlying computing resources. The authors describe in detail various efforts to generate approximate hardware systems, while still providing an overview of support techniques at other computing layers. The book is organized by techniques for various hardware components, from basic building blocks to general circuits and systems.
EDA for IC Implementation, Circuit Design, and Process Technology
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Machine Learning on Commodity Tiny Devices
This book aims at the tiny machine learning (TinyML) software and hardware synergy for edge intelligence applications. It presents on-device learning techniques covering model-level neural network design, algorithm-level training optimization, and hardware-level instruction acceleration. Analyzing the limitations of conventional in-cloud computing would reveal that on-device learning is a promising research direction to meet the requirements of edge intelligence applications. As to the cutting-edge research of TinyML, implementing a high-efficiency learning framework and enabling system-level acceleration is one of the most fundamental issues. This book presents a comprehensive discussion of...
Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
High Assurance Services Computing
Service computing is a cutting-edge area, popular in both industry and academia. New challenges have been introduced to develop service-oriented systems with high assurance requirements. High Assurance Services Computing captures and makes accessible the most recent practical developments in service-oriented high-assurance systems. An edited volume contributed by well-established researchers in this field worldwide, this book reports the best current practices and emerging methods in the areas of service-oriented techniques for high assurance systems. Available results from industry and government, R&D laboratories and academia are included, along with unreported results from the “hands-on” experiences of software professionals in the respective domains. Designed for practitioners and researchers working for industrial organizations and government agencies, High Assurance Services Computing is also suitable for advanced-level students in computer science and engineering.
3D Integration for NoC-based SoC Architectures
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Modern Circuit Placement
This book covers advanced techniques in modern circuit placement. It details all of most recent placement techniques available in the field and analyzes the optimality of these techniques. Coverage includes all the academic placement tools that competed against one another on the same industrial benchmark circuits at the International Symposium on Physical Design (ISPD), these techniques are also extensively being used in industrial tools as well. The book provides significant amounts of analysis on each technique such as trade-offs between quality-of-results (QoR) and runtime.
CMOSET 2012 Final Program
Final program for the CMOSET 2012 conference
VLSI-SoC: Design Trends
This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.* The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs. *The conference was held virtually.
