Welcome to our book review site go-pdf.online!
You may have to Search all our reviewed books and magazines, click the sign up button below to create a free account.
Contracts for Engineers
Engineers encounter different types of contracts at nearly every turn in their careers. Contracts for Engineers: Intellectual Property, Standards, and Ethics is a tool to enhance their ability to communicate contractual issues to lawyers—and then better understand the legal advice they receive. Building on its exploration of contracts, this book expands discussion to: Patents, copyrights, trademarks, trade secrets, and other intellectual property issues Development of standards and the bodies that govern them, as well as conformity assessment and accreditation Ethics at both the micro and macro levels—a concept under major scrutiny after several major disasters, including the Gulf of Mex...
Power Electronic Packaging
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Federal Register
None
Networking Foundations
The world of IT is always evolving, but in every area there are stable, core concepts that anyone just setting out needed to know last year, needs to know this year, and will still need to know next year. The purpose of the Foundations series is to identify these concepts and present them in a way that gives you the strongest possible starting-point, no matter what your endeavor. Networking Foundations provides essential knowledge about designing, building, and maintaining a network. What you learn here will benefit you in the short term, as you acquire and practice your skills, and in the long term, as you use them. Topics covered include: Networking fundamentals The OSI networking model Network architectures File servers and network clients Physical and logical topologies Electrical issues in networking Network media and cabling devices Network standards and protocols LAN installation WAN basics Internet access
Thermal and Electro-thermal System Simulation 2020
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal s...
Integrated Interconnect Technologies for 3D Nanoelectronic Systems
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Materials Enabled Designs
There are books aplenty on materials selection criteria for engineering design. Most cover the physical and mechanical properties of specific materials, but few offer much in the way of total product design criteria. This innovative new text/reference will give the "Big picture view of how materials should be selected—not only for a desired function but also for their ultimate performance, durability, maintenance, replacement costs, and so on. Even such factors as how a material behaves when packaged, shipped, and stored will be taken into consideration. For without that knowledge, a design engineer is often in the dark as to how a particular material used in particular product or process ...
Inside Solid State Drives (SSDs)
Solid State Drives (SSDs) are gaining momentum in enterprise and client applications, replacing Hard Disk Drives (HDDs) by offering higher performance and lower power. In the enterprise, developers of data center server and storage systems have seen CPU performance growing exponentially for the past two decades, while HDD performance has improved linearly for the same period. Additionally, multi-core CPU designs and virtualization have increased randomness of storage I/Os. These trends have shifted performance bottlenecks to enterprise storage systems. Business critical applications such as online transaction processing, financial data processing and database mining are increasingly limited ...
