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In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazi...
Here, the well-known editor in the field of electrocrystallization and his team of excellent international authors guarantee the high quality of the contributions. Clearly structured in two main parts, this book reviews the fundamentals and applications of electrocrystallization processes in nanotechnology. The first part, "Fundamentals" covers the basic concepts of electrocrystallization, computer simulations of low-dimensional metal phase formation, electrodeposition in templates and nanocavities, nanoscale electrocrystallization from ionic liquids, and superconformal electrodeposition of metals. The second part, "Preparation and properties of nanostructures", includes nanostructuring by S...
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Electrochemical Processing in ULSI and MEMS 4¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, CA from May 24 to 29, 2009.