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Advanced Materials for Thermal Management of Electronic Packaging
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionar...
Advanced Materials and Design for Electromagnetic Interference Shielding
With electromagnetic compliance (EMC) now a major factor in the design of all electronic products, it is crucial to understand how electromagnetic interference (EMI) shielding products are used in various industries. Focusing on the practicalities of this area, Advanced Materials and Design for Electromagnetic Interference Shielding comprehensively
Advanced Materials for Integrated Optical Waveguides
This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with curr...
Functional Metamaterials and Metadevices
To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices. Coverage includes electromagnetic, optical, acoustic, thermal, and mechanical metamaterials and related metadevices. Metamaterials are artificially engineered composites with designed properties beyond those attainable in nature and with applications in all aspects of materials science. From spatially tailored dielectrics to tunable, dynamic materials properties and unique nonlinear behavior, metamaterial systems have demonstrated tremendous flex...
The Physics of Energy
A comprehensive and unified introduction to the science of energy sources, uses, and systems for students, scientists, engineers, and professionals.
War and Popular Culture
This is the first comprehensive study of popular culture in twentieth-century China, and of its political impact during the Sino-Japanese War of 1937-1945 (known in China as "The War of Resistance against Japan"). Chang-tai Hung shows in compelling detail how Chinese resisters used a variety of popular cultural forms—especially dramas, cartoons, and newspapers—to reach out to the rural audience and galvanize support for the war cause. While the Nationalists used popular culture as a patriotic tool, the Communists refashioned it into a socialist propaganda instrument, creating lively symbols of peasant heroes and joyful images of village life under their rule. In the end, Hung argues, the Communists' use of popular culture contributed to their victory in revolution.
Annual Review of Nano Research
The first volume in an exciting new series, Annual Review of Nano Research, this formidable collection of review articles sees renowned contributors from eight different countries tackle the most recent advances in nanofabrication, nanomaterials and nanostructures.The broad coverage of topics in nanotechnology and nanoscience also includes a special focus on the hot topic of biomedical applications of nanomaterials. The important names contributing to the volume include: M R Bockstaller (USA), L Duclaux (France), S Forster (Germany), W Fritzsche (Germany), L Jiang (China), C Lopez (Spain), W J Parak (Germany), B Samori (Italy), U S Schubert (The Netherlands), S Shinkai (Japan), A Stein (USA), S M Hou (China), and Y N Xia (USA).The volume serves both as a handy reference for experts active in the field and as an excellent introduction to scientists whose expertise lies elsewhere but who are interested in learning about this cutting-edge research area.
Electromagnetic Interference and Compatibility
Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials.
Electrical Design of Overhead Power Transmission Lines
Complete coverage of power line design and implementation "This text provides the essential fundamentals of transmission line design. It is a good blend of fundamental theory with practical design guidelines for overhead transmission lines, providing the basic groundwork for students as well as practicing power engineers, with material generally not found in one convenient book." IEEE Electrical Insultation Magazine Electrical Design of Overhead Power Transmission Lines discusses everything electrical engineering students and practicing engineers need to know to effectively design overhead power lines. Cowritten by experts in power engineering, this detailed guide addresses component selecti...
