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Heat Transfer
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Flextronics International Ltd Patent Landscape Analysis – January 1, 1994 to December 31, 2013
The following analysis illustrates the underlying trends and relationships of U.S. issued patents of the subject company. The analysis employs two frequently used patent classification methods: US Patent Classification (UPC) and International Patent Classification (IPC). Aside from assisting patent examiners in determining the field of search for newly submitted patent applications, the two classification methods play a pivotal role in the characterization and analysis of technologies contained in collections of patent data. The analysis also includes the company’s most prolific inventors, top cited patents as well as foreign filings by technology area.
Recent Advances in Sustainable Energy and Intelligent Systems
The three-volume set CCIS 1467, CCIS 1468, and CCIS 1469 constitutes the thoroughly refereed proceedings of the 7th International Conference on Life System Modeling and Simulation, LSMS 2021, and of the 7th International Conference on Intelligent Computing for Sustainable Energy and Environment, ICSEE 2021, held in Hangzhou, China, in October 2021. The 159 revised papers presented were carefully reviewed and selected from over 430 submissions. The papers of this volume are organized in topical sections on: Medical Imaging and Analysis Using Intelligence Computing; Biomedical signal processing, imaging, visualization and surgical robotics; Computational method in taxonomy study and neural dyn...
ITherm 2002
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ITHERM
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Thermal Management for Opto-electronics Packaging and Applications
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this a...
Annual Commencement
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