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This two volume set LNAI 8917 and 8918 constitutes the refereed proceedings of the 7th International Conference on Intelligent Robotics and Applications, ICIRA 2014, held in Guangzhou, China, in December 2014. The 109 revised full papers presented were carefully reviewed and selected from 159 submissions. The papers aim at enhancing the sharing of individual experiences and expertise in intelligent robotics with particular emphasis on technical challenges associated with varied applications such as biomedical applications, industrial automations, surveillance, and sustainable mobility.
Abrasive technology is becoming increasingly important in precision manufacturing. This volume contains more than 70 refereed technical papers contributed by worldwide academic researchers and industrial practitioners, on the latest development in abrasive technology. Specifically, it covers the mechanics and mechanisms of abrasive processes as well as the technologies and applications related to abrasive jet machining, nano-machining, grinding, polishing, horning and lapping. It also includes topics on high- speed machining, eco-machining and laser micro-machining technologies. The discussion is on the practical applications of abrasive technology and the associated theories make this book very useful for academic researchers and industrial practitioners.
Selected, peer reviewed papers from the 3rd International Conference on Advanced Design and Manufacture (ADM 2010), 8-10 September 2010, Nottingham, UK
Selected, peer reviewed papers from the 14th Annual Conference and the 3rd International Conference of the Chinese Society of Micro-Nano Technology (CSMNT 2012), November 4-7, 2012, Hangzhou, China
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.