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Highly regarded text presents detailed discussion of fundamental aspects of theory, background, problems with detailed solutions. Basics of thermoelasticity, heat transfer theory, thermal stress analysis, more. 1985 edition.
Includes the Committee's Technical reports no. 1-1058, reprinted in v. 1-37.
Properties of wave localization play a decisive role both in applications of engineered microstructures and in the detection of cracks and flaws. The papers in this volume give an introduction into a variety of interrelated dynamic localization phenomena occurring in elasticity, acoustics and electromagnetism. In particular, these involve surface and edge waves and also trapped modes localized near defects, shape changes and the edges of elongated waveguides. The effects of layering, prestress, anisotropy, periodic microstructures as well as various multi-field phenomena are addressed with reference to underlying industrial problems. The essential and up-to-date numerical, asymptotic, and analytical techniques are covered as well as relevant continuum theories that are required to make progress in, and understand wave localization and allied effects. A major focus is on a qualitative physical insight into the mechanisms of dynamic localization.
This book provides a detailed history of the United States National Committee on Theoretical and Applied Mechanics (USNC/TAM) of the US National Academies, the relationship between the USNC/TAM and IUTAM, and a review of the many mechanicians who developed the field over time. It emphasizes the birth and growth of USNC/TAM, the birth and growth of the larger International Union of Theoretical and Applied Mechanics (IUTAM), and explores the work of mechanics from Aristotle to the present. Written by the former Secretary of USNC/TAM, Dr. Carl T. Herakovich of the University of Virginia, the book profiles luminaries of mechanics including Galileo, Newton, Bernoulli, Euler, Cauchy, Prandtl, Einstein, von Kármán, Timoshenko, and in so doing provides insight into centuries of scientific and technologic advance.