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A History Of Korea
First published in 1996. Always there are hills in the distance, backed by mountains, wreathed in mist, and always the sound of water. These are the things that have inspired the Korea’s poets and artists and haunt the dreams of its exiles. An eastern backbone of sharp mountains has ribs that run westward and from these wooded hills flow the water that trickles through the rice fields. Climatic maps show it to be at the centre of a small area that is almost unique in its combination of cold dry winters and hot rainy summers. Most of its plants and animals are common to the temperate zone of the Northern Hemisphere but they are tested almost to destruction by seasonal alternations of Siberian cold and summer monsoons. In May the brown desert of winter begins to shimmer in a delicate veil of green which grows into a summer jungle and dies with glory in a long warm autumn of red and gold. About 600 miles in length and 150-200 miles wide, it reaches out from the mainland like an oriental Italy, with China embracing it to the north and west and Japan only 100 miles away to the south and east. This book illuminates the reader about the history of Korea.
The Paths To Immortal
With his every move, the world is turned upside down!
Congressional Record
None
Dengue and Dengue Hemorrhagic Fever, 2nd Edition
Continued geographic expansion of dengue viruses and their mosquito vectors has seen the magnitude and frequency of epidemic dengue/dengue hemorrhagic fever (DF/DHF) increase dramatically. Recent exciting research on dengue has resulted in major advances in our understanding of all aspects of the biology of these viruses, and this updated second edition brings together leading research and clinical scientists to review dengue virus biology, epidemiology, entomology, therapeutics, vaccinology and clinical management.
Semiconductor Advanced Packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Index Medicus
Vols. for 1963- include as pt. 2 of the Jan. issue: Medical subject headings.
