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Copper Electrodeposition for Nanofabrication of Electronics Devices
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Advances in Electrochemical Science and Engineering
Volume 7 in the well-established series "Advances in Electrochemical Science and Engineering" covers - among others - important topics on electrodeposition. As in all previous volumes, the editors have succeeded in selecting highly topical areas of electrochemical research and in presenting authors who are leaders in their fields. The result is a compelling set of reviews which serves equally well as an excellent and up-to-date source of information for experienced researchers active in the field as well as an introduction for newcomers. From reviews of the previous volumes: 'This is an essential book for researchers in electrochemistry; it covers areas of both fundamental and practical impo...
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