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A comprehensive introduction to the fundamentals of ferroelectrics, including available materials, device designs, drive/control techniques, and essential applications - examining high-permittivity dielectrics, piezoelectric devices, pyroelectric sensors, and electro-optic devices. It focuses on highly adaptive polycrystalline ceramics and other materials used in thin/thick film devices. The book features the author's exclusive device development method.
Dielectric Elastomers as Electromechanical Transducers provides a comprehensive and updated insight into dielectric elastomers; one of the most promising classes of polymer-based smart materials and technologies. This technology can be used in a very broad range of applications, from robotics and automation to the biomedical field. The need for improved transducer performance has resulted in considerable efforts towards the development of devices relying on materials with intrinsic transduction properties. These materials, often termed as “smart or “intelligent , include improved piezoelectrics and magnetostrictive or shape-memory materials. Emerging electromechanical transduction techno...
This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, etc., are of equa...
This book illustrates interfacial properties, preparation, characterization, devices, and applications from the standpoint of nano-interfacial tailoring. Since the primary focus of the book is on the use of nanocomposite dielectrics in electrical applications, chapters are devoted to directly relevant topics, such as surface and bulk breakdown processes. However, the mechanisms that underpin such behavior are not unique. Therefore, the book also addresses related topics that range from the chemistry of polymer and nanocomposite degradation to the simulation of charge transport dynamics in disordered materials, thereby presenting a multi- and interdisciplinary approach to the area. It will serve as a practical handbook or graduate textbook and is supplemented by ample number of illustrations, case studies, practical examples, and historical perspectives.
Electromagnetic materials can be widely found in daily life, especially in electronic devices. The high-frequency properties (permittivity or permeability) of these materials strongly depend on structure, composition, shape, and orientation. Therefore, this book intends to present readers with advances not only in materials science (including metamaterials), but also in measurements and novel functional applications that demand the special properties of electromagnetic materials.
The goal of this NATO Advanced Research Workshop (ARW) entitled “Defects in Advanced High-k Dielectric Nano-electronic Semiconductor Devices”, which was held in St. Petersburg, Russia, from July 11 to 14, 2005, was to examine the very complex scientific issues that pertain to the use of advanced high dielectric constant (high-k) materials in next generation semiconductor devices. The special feature of this workshop was focus on an important issue of defects in this novel class of materials. One of the key obstacles to high-k integration into Si nano-technology are the electronic defects in high-k materials. It has been established that defects do exist in high-k dielectrics and they play an important role in device operation. However, very little is known about the nature of the defects or about possible techniques to eliminate, or at least minimize them. Given the absence of a feasible alternative in the near future, well-focused scientific research and aggressive development programs on high-k gate dielectrics and related devices must continue for semiconductor electronics to remain a competitive income producing force in the global market.