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This book was written with several objectives in mind: 1. To share with as many scientists and engineers as possible the intriguing scientific aspects of ultra-fine particles (UFPs) and to show their potential as new materials. 2. Entice such researchers to participate in the development of this emerging field. 3. To publicize the achievements of the Ultra-Fine Particle Project, which was carried out under the auspices of the Exploratory Research for Advanced Technology program (ERATO). In addition to the members of the Ultra-Fine Particle Project, contributions from other pioneers in this field are included. To achieve the first objective described above, the uniformity of the contents and focus on a single central theme have been sacrificed somewhat to provide a broad coverage. It is expected that the reader can discover an appropriate topic for further development of new materials and basic technology by reading selected sections of this book. Alternately, one may gain an overview of this new field by reviewing the entire book, which can potentially lead to new directions in the development of UFPs.
This book presents an updated, systematic review of the latest developments in diamond CVD processes, with emphasis on the nucleation and early growth of diamond CVD. The objective is to familiarize the reader with the scientific and engineering aspects of diamond CVD, and to provide experiences researchers, scientists, and engineers in academia and industry with the latest developments in this growing field.
This book describes the design, physics, and performance of high density plasma sources which have been extensively explored in low pressure plasma processing, such as plasma etching and planarization, plasma enhanced chemical vapor deposition of thin films, sputtered deposition of metals and dielectrics, epitaxial growth of silicon and GaAs, and many other applications. This is a comprehensive survey and a detailed description of most advanced high density plasma sources used in plasma processing. The book is a balanced presentation in that it gives both a theoretical treatment and practical applications. It should be of considerable interest to scientists and engineers working on plasma source design, and process development.
Facilities which utilize hazardous liquids and gases represent a significant potential liability to the owner, operator, and general public in terms of personnel safety and preservation of assets. It is obvious that a catastrophic incident or loss of property or personnel is to be avoided at all costs. This book was conceived to give the reader a guide to understanding the requirements of the various codes and regulations that apply to the design, construction, and operation of facilities utilizing hazardous materials in their processes.
Turn to this new second edition for an understanding of the latest advances in the chemical vapor deposition (CVD) process. CVD technology has recently grown at a rapid rate, and the number and scope of its applications and their impact on the market have increased considerably. The market is now estimated to be at least double that of a mere seven years ago when the first edition of this book was published. The second edition is an update with a considerably expanded and revised scope. Plasma CVD and metallo-organic CVD are two major factors in this rapid growth. Readers will find the latest data on both processes in this volume. Likewise, the book explains the growing importance of CVD in production of semiconductor and related applications.
An invaluable resource for industrial science and engineering newcomers to sputter deposition technology in thin film production applications, this book is rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, a key technology for nano-materials in high-speed information applications and large-area functional coating such as automotive or decorative painting of plastic parts, among other topics. In seven concise chapters, the book thoroughly reviews basic thin film technology and deposition processes, sputtering processes, structural control of compound thin films, and microfabrication by sputtering.
Unique in bringing about a solid-state reaction at room temperature, mechanical alloying produces powders and compounds difficult or impossible to obtain by conventional techniques. Immediate and cost-effective industry applications of the resultant advanced materials are in cutting tools and high performance aerospace products such as metal matrix armor and turbine blades. The book is a guided introduction to mechanical alloying, covering material requirements equipment, processing, and engineering properties and characteristics of the milled powders. Chapters 3 and 4 treat the fabrication of nanophase materials and nanophase composite materials. Chapter 8 provides extensive coverage of metallic glass substances.This book is ideal for materials scientists in industry and in research, design, processing, and plant engineers in the cutting tools and aerospace industries as well as senior level students in metallurgical and mechanical materials engineering. The book will especially benefit metallurgists unacquainted with ball milling fabrication.
Written by an international expert, this book covers the processing, microstructure, and properties of cemented tungsten carbides. It is divided into 18 chapters covering wide areas from crystal structure to phase equilibria, production of metal and carbide powders, and much more. This book is ideal for researchers, plant engineers, and senior level students in metallurgical/mechanical/materials engineering who are interested in cemented carbides. There is no parallel book in print.