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Proceedings of the Symposium on Reliability of Metals in Electronics
  • Language: en
  • Pages: 258
Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials
  • Language: en
  • Pages: 278
Official Gazette of the United States Patent and Trademark Office
  • Language: en
  • Pages: 1438

Official Gazette of the United States Patent and Trademark Office

  • Type: Book
  • -
  • Published: 2001
  • -
  • Publisher: Unknown

None

Low and High Dielectric Constant Materials
  • Language: en
  • Pages: 262

Low and High Dielectric Constant Materials

Contains papers from a May 2000 symposium, representing the state of the art in areas of dielectric materials science and process integration. Papers are arranged in sections on low and high dielectric constant materials, covering topics such as ammonia plasma passivation effects on properties of post-CMP low-k HSQ, characterization of ashing effects on low-k dielectric films, and electron beam curing of thin film polymer dielectrics. Other subjects include characterization of high-k dielectrics using the non-contact surface charge profiler method, and processing effects and electrical evaluation of ZrO2 formed by RTP oxidation of Zr. Loboda is affiliated with Dow Corning Corporation. c. Book News Inc.

Official Gazette of the United States Patent and Trademark Office
  • Language: en
  • Pages: 1038

Official Gazette of the United States Patent and Trademark Office

  • Type: Book
  • -
  • Published: 2000
  • -
  • Publisher: Unknown

None

Index of Patents Issued from the United States Patent and Trademark Office
  • Language: en
  • Pages: 1948

Index of Patents Issued from the United States Patent and Trademark Office

  • Type: Book
  • -
  • Published: 1993
  • -
  • Publisher: Unknown

None

Proceedings of the Symposia on Reliability of Semiconductor Devices/interconnections and Dielectric Breakdown, and Laser Process for Microelectronic Applications
  • Language: en
  • Pages: 346

Proceedings of the Symposia on Reliability of Semiconductor Devices/interconnections and Dielectric Breakdown, and Laser Process for Microelectronic Applications

Papers in this volume are from the 180th ECS Meeting, held in held in Phoenix, Arizona, Fall 1991. This symposium addresses all aspects of reliability of semiconductor devices, multilevel interconnection and dielectric breakdown in VLSI and ULSI technologies. The symposium establishes reliability from design through manufacturing. The second part of the symposium addresses laser ablation/etching, laser planarization laser/UV. CVD of metal end dielectric films, laser/UV enhanced etching and deposition processesing liquid phase, and photomodification of surfaces.

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics
  • Language: en
  • Pages: 262
IEEE International Reliability Physics Symposium Proceedings
  • Language: en
  • Pages: 766
AKASHVANI
  • Language: en
  • Pages: 48

AKASHVANI

"Akashvani" (English ) is a programme journal of ALL INDIA RADIO ,it was formerly known as The Indian Listener.It used to serve the listener as a bradshaw of broadcasting ,and give listener the useful information in an interesting manner about programmes, who writes them,take part in them and produce them along with photographs of performing artists.It also contains the information of major changes in the policy and service of the organisation. The Indian Listener (fortnightly programme journal of AIR in English) published by The Indian State Broadcasting Service, Bombay, started on 22 december, 1935 and was the successor to the Indian Radio Times in english, which was published beginning in...