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Interconnections
Perlman, a bestselling author and senior consulting engineer for Sun Microsystems, provides insight for building more robust, reliable, secure and manageable networks. Coverage also includes routing and addressing strategies, VLANs, multicasting, IPv6, and more.
High-Speed VLSI Interconnections
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Interconnection Noise in VLSI Circuits
This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.
Area Array Interconnection Handbook
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Tec...
Automating with PROFINET
PROFINET is the first integrated Industrial Ethernet Standard for automation, and utilizes the advantages of Ethernet and TCP/IP for open communication from the corporate management level to the process itself. PROFINET CBA divides distributed, complex applications into autonomous units of manageable size. Existing fieldbuses such as PROFIBUS and AS-Interface can be integrated using so-called proxies. This permits separate and cross-vendor development, testing and commissioning of individual plant sections prior to the integration of the solution as a whole. PROFINET IO, with its particularly fast real-time communication, fulfills all demands currently placed on the transmission of process d...
Work, Family, and Community
Research in recent decades has proven that the seemingly disparate worlds of family life and the workplace are in fact closely intertwined. Moreover, scholars have begun to recognize the extent to which community life influences the work-family interface, for instance, the lack of fit between school hours and work hours, and assistance provided by community-based child care services. Work, Family, and Community is the first to provide a comprehensive review and analysis of the theoretical and empirical research that has examined the complex interconnections among these domains. This book integrates literature from several disciplines, including sociology, industrial-organizational and occupa...
Large-Scale Fuzzy Interconnected Control Systems Design and Analysis
Large-scale interconnected systems have become more prominent in society due to a higher demand for sustainable development. As such, it is imperative to create effective methods and techniques to control such systems. Large-Scale Fuzzy Interconnected Control Systems Design and Analysis is an innovative source of academic research that discusses the latest approaches to control large-scale systems, and the challenges that occur when implementing them. Highlighting a critical range of topics such as system stability, system stabilization, and fuzzy rules, this book is an ideal publication for engineers, researchers, academics, graduate students, and practitioners interested in the design of large-scale interconnected systems.
Microelectronic System Interconnections
Microelectronic system interconnections provides a uniques approach to the subject.
The Competitive Internet Service Provider
Due to the dramatic increase in competition over the last few years, it has become more and more important for Internet Service Providers (ISPs) to run an efficient business and offer an adequate Quality of Service. The Competitive Internet Service Provider is a comprehensive guide for those seeking to do just that. Oliver Heckmann approaches the issue from a system point of view, looking not only at running a network, but also at connecting the network with peering and transit partners or planning the expansion of the network. The Competitive Internet Service Provider: Offers an advanced reference on the topic, drawing on state-of-the art research in network technology. Clearly defines the ...
