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Modem materials science is exploiting novel tools of solid-state physics and chemistry to obtain an unprecedented understanding of the structure of matter at the atomic level. The direct outcome of this understanding is the ability to design and fabricate new materials whose properties are tailored to a given device ap plication. Although applications of materials science can range from low weight, high strength composites for the automobile and aviation industry to biocompat ible polymers, in no other field has progress been more strikingly rapid than in that of electronic materials. In this area, it is now possible to predict from first principles the properties of hypothetical materials a...
Many of the most important properties of materials in high-technology applications are strongly influenced or even controlled by the presence of solid interfaces. In this work, leading international authorities review the broad range of subjects in this field focusing on the atomic level properties of solid interfaces.
This book presents the most recent important ideas and developments in the field of Hydrogenated Amorphous Silicon and related materials. Each contribution is authored by an outstanding expert in that particular area.
How does the field of optical engineering impact biotechnology? Perhaps for the first time, Applied Optics Fundamentals and Device Applications: Nano, MOEMS, and Biotechnology answers that question directly by integrating coverage of the many disciplines and applications involved in optical engineering, and then examining their applications in nanobiotechnology. Written by a senior U.S. Army research scientist and pioneer in the field of optical engineering, this book addresses the exponential growth in materials, applications, and cross-functional relevance of the many convergent disciplines making optical engineering possible, including nanotechnology, MEMS, (MOEMS), and biotechnology. Int...
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Surface engineering is an increasingly important field and consequently those involved need to be aware of the vast range of technologies available to modify surfaces. This text provides an up-to-date, authoritative exposition of the major condensed phase methods used for producing metallurgical and ceramic coatings. Each method is discussed thoroughly by an expert in that field. In each chapter the principle of the method, its range of applications and technical aspects involved are described. The book not only informs the reader about established technologies familiar only to specialists, but also details activity on the frontier of coating technology providing an insight into those potential technologies not yet fully developed but which should emerge in the near future.
Treatise on Materials Science and Technology, Volume 24: Preparation and Properties of Thin Films covers the progress made in the preparation of thin films and the corresponding study of their properties. The book discusses the preparation and property correlations in thin film; the variation of microstructure of thin films; and the molecular beam epitaxy of superlattices in thin film. The text also describes the epitaxial growth of silicon structures (thermal-, laser-, and electron-beam-induced); the characterization of grain boundaries in bicrystalline thin films; and the mechanical properties of thin films on substrates. The ion beam modification of thin film; the use of thin alloy films for metallization in microelectronic devices; and the fabrication and physical properties of ultrasmall structures are also encompassed. Materials scientists and materials engineers will find the book invaluable.
The impact of Materials Science in our environment has probably never been as massive and decisive as it is today. In every aspect of our lives, progress has never been so dependent on the techniques involved in producing ever more sophisticated materials in ever larger quantities, nor so demanding for technologists to imagine novel processes and circumvent difficulties, or take up new challenges. Every technique is based on a physical process which is put into practice and optimized. The better we know that process, the better the optimization, and more powerful the technique. Laser processing of materials is inscribed in that context. As soon as powerful coherent light sources were made av...
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come to...