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Failure Analysis of Integrated Circuits
  • Language: en
  • Pages: 256

Failure Analysis of Integrated Circuits

This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

Register of Commissioned and Warrant Officers of the United States Naval Reserve
  • Language: en
  • Pages: 842

Register of Commissioned and Warrant Officers of the United States Naval Reserve

  • Type: Book
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  • Published: 1959
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  • Publisher: Unknown

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Microelectronics Failure Analysis
  • Language: en
  • Pages: 813

Microelectronics Failure Analysis

For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron

Handbook of Semiconductor Manufacturing Technology
  • Language: en
  • Pages: 1722

Handbook of Semiconductor Manufacturing Technology

  • Type: Book
  • -
  • Published: 2017-12-19
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  • Publisher: CRC Press

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five enti...

The Michigan Alumnus
  • Language: en
  • Pages: 694

The Michigan Alumnus

In v.1-8 the final number consists of the Commencement annual.

Characterization of Integrated Circuit Packaging Materials
  • Language: en
  • Pages: 293

Characterization of Integrated Circuit Packaging Materials

  • Type: Book
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  • Published: 2013-10-22
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  • Publisher: Elsevier

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

The Cleveland Directory Co.'s Cleveland (Cuyahoga County, Ohio) City Directory
  • Language: en
  • Pages: 850

The Cleveland Directory Co.'s Cleveland (Cuyahoga County, Ohio) City Directory

  • Type: Book
  • -
  • Published: 1884
  • -
  • Publisher: Unknown

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VLSI Handbook
  • Language: en
  • Pages: 929

VLSI Handbook

VLSI Handbook is a reference guide on very large scale integration (VLSI) microelectronics and its aspects such as circuits, fabrication, and systems applications. This handbook readily answers specific questions and presents a systematic compilation of information regarding the VLSI technology. There are a total of 52 chapters in this book and are grouped according to the fields of design, materials and processes, and examples of specific system applications. Some of the chapters under fields of design are design automation for integrated circuits and computer tools for integrated circuit design. For the materials and processes, there are many chapters that discuss this aspect. Some of them...

Istfa 2003
  • Language: en
  • Pages: 534

Istfa 2003

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