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Physical Assurance
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Materials for Electronics Security and Assurance
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable...
Hardware Security
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Constructive Side-Channel Analysis and Secure Design
This book constitutes revised selected papers from the 10th International Workshop on Constructive Side-Channel Analysis and Secure Design, COSADE 2019, held in Darmstadt, Germany, in April 2019. The 14 papers presented together with one keynote and one invited talk in this volume were carefully reviewed and selected from 34 submissions. They were organized in topical sections named: Side-Channel Attacks; Fault-Injection Attacks; White-Box Attacks; Side-Channel Analysis Methodologies; Security Aspects of Post-Quantum Schemes; and Countermeasures Against Implementation Attacks.
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Counterfeit Integrated Circuits
This timely and exhaustive study offers a much-needed examination of the scope and consequences of the electronic counterfeit trade. The authors describe a variety of shortcomings and vulnerabilities in the electronic component supply chain, which can result in counterfeit integrated circuits (ICs). Not only does this book provide an assessment of the current counterfeiting problems facing both the public and private sectors, it also offers practical, real-world solutions for combatting this substantial threat. · Helps beginners and practitioners in the field by providing a comprehensive background on the counterfeiting problem; · Presents innovative taxonomies for counterfeit types, test methods, and counterfeit defects, which allows for a detailed analysis of counterfeiting and its mitigation; · Provides step-by-step solutions for detecting different types of counterfeit ICs; · Offers pragmatic and practice-oriented, realistic solutions to counterfeit IC detection and avoidance, for industry and government.
Processing and Properties of Advanced Ceramics and Composites VII
This volume contains 40 papers from the following 10 Materials Science and Technology (MS&T'14) symposia: Rustum Roy Memorial Symposium: Processing and Performance of Materials Using Microwaves, Electric and Magnetic Fields, Ultrasound, Lasers, and Mechanical Work Advances in Dielectric Materials and Electronic Devices Innovative Processing and Synthesis of Ceramics, Glasses and Composites Advances in Ceramic Matrix Composites Sintering and Related Powder Processing Science and Technology Advanced Materials for Harsh Environments Thermal Protection Materials and Systems Advanced Solution Based Processing for Ceramic Materials Controlled Synthesis, Processing, and Applications of Structure and Functional Nanomaterials Surface Protection for Enhanced Materials Performance
Emerging Topics in Hardware Security
This book provides an overview of emerging topics in the field of hardware security, such as artificial intelligence and quantum computing, and highlights how these technologies can be leveraged to secure hardware and assure electronics supply chains. The authors are experts in emerging technologies, traditional hardware design, and hardware security and trust. Readers will gain a comprehensive understanding of hardware security problems and how to overcome them through an efficient combination of conventional approaches and emerging technologies, enabling them to design secure, reliable, and trustworthy hardware.
Advanced Photonics Methods for Biomedical Applications
Advanced photonics methods for biomedical applications give researchers in universities and industries, and clinicians an overview of the novel tools for cancer diagnostics and treatment. This book provides researchers and professionals in the area of biomedical photonics with a toolbox of novel methodologies for biomedical applications, including health diagnostics, cancer detection, and treatment. It covers the theory, modeling, and design of each method, alongside their applications, fabrication, characterization, and measurements in clinical practice. A wide scope of concepts concerning innovative science and technologies of medicine will be covered, providing the readers with the latest...
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
