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Reliability of MEMS
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
LIGA and its Applications
Covering technological aspects as well as the suitability and applicability of various kinds of uses, this handbook shows optimization strategies, techniques and assembly pathways to achieve the combination of complex, even three-dimensional structures with simple manufacturing steps. The authors provide information on markets, commercialization opportunities and aspects of mass or large-scale production as well as design tools, experimental techniques, novel materials, and ideas for future improvements. Not only do they weigh up cost versus quantity, they also consider CMOS and LIGA strategies. Of interest to physicists, electronics engineers, materials scientists, institutional and industrial libraries as well as graduate students of the relevant disciplines.
Tutorials in Nanotechnology: Focus on Sensors
This issue of ECS Transactions collects the invited presentations presented during this tutorial session. The topics cover the broad range of nanotechnology related both to sensors and to nanomechanical systems. Both "top-down" and "bottom-up" methods of fabrication are covered. Topics include atomic layer desorption, fabrication, nanoelectronics, nano-fluidics.
Handbook of 3D Integration, Volume 1
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Micro Total Analysis Systems 2000
This volume contains the proceedings of the fourth international symposium on Micro Total Analysis Systems (muTAS 2000). Cutting-edge research of all invited and contributed papers presented by the world’s leading muTAS groups provides the state of the art of this electrifying, multidisciplinary field.
Micro Process Engineering
This edition of 'Micro Process Engineering' was originally published in the successful series 'Advanced Micro & Nanosystems'. Authors from leading industrial players and research institutions present a concise and didactical introduction to Micro Process Engineering, the combination of microtechnology and process engineering into a most promising and powerful tool for revolutionizing chemical processes and industrial mass production of bulk materials, fine chemicals, pharmaceuticals and many other products. The book takes the readers from the fundamentals of engineering methods, transport processes, and fluid dynamics to device conception, simulation and modelling, control interfaces and issues of modularity and compatibility. Fabrication strategies and techniques are examined next, focused on the fabrication of suitable microcomponents from various materials such as metals, polymers, silicon, ceramics and glass. The book concludes with actual applications and operational aspects of micro process systems, giving broad coverage to industrial efforts in America, Europe and Asia as well as laboratory equipment and education.
Micro and Nano Scale NMR
This must-have book is the first self-contained summary of recent developments in the field of microscale nuclear magnetic resonance hardware, covering the entire technology from miniaturized detectors, the signal processing chain, and detection sequences. Chapters cover the latest advances in interventional NMR and implantable NMR sensors, as well as in using CMOS technology to manufacture miniaturized, highly scalable NMR detectors for NMR microscopy and high-throughput arrays of NMR spectroscopy detectors.
