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Handbook of 3D Integration, Volume 3
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Handbook of Wafer Bonding
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Handbook of 3D Integration, Volume 1
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Tomb – Memory – Space
From an intercultural perspective, this book focuses on aesthetic strategies and forms of representation in premodern Christian and Islamic sepulchral art. Seeing the tomb as an interface for eschatological, political, and artistic debate, the contributions analyze the diversity of memorial space configurations. The subjects range from the complex interaction between architecture and tomb topography through to questions relating to the funereal expression of power and identity, and to practices of ritual realization in the context of individual and collective memory.
Correspondance
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Processing, Materials, and Integration of Damascene and 3D Interconnects
This issue focuses on recent advances in damascene interconnects and 3D interconnects.
Energy Harvesting Systems
Kinetic energy harvesting converts movement or vibrations into electrical energy, enables battery free operation of wireless sensors and autonomous devices and facilitates their placement in locations where replacing a battery is not feasible or attractive. This book provides an introduction to operating principles and design methods of modern kinetic energy harvesting systems and explains the implications of harvested power on autonomous electronic systems design. It describes power conditioning circuits that maximize available energy and electronic systems design strategies that minimize power consumption and enable operation. The principles discussed in the book will be supported by real case studies such as battery-less monitoring sensors at water waste processing plants, embedded battery-less sensors in automotive electronics and sensor-networks built with ultra-low power wireless nodes suitable for battery-less applications.
Advanced Microsystems for Automotive Applications 2009
The current economic crisis is cutting the automotive sector to the quick. Public authorities worldwide are now faced with requests for providing loans and accepting guarantees and even for putting large automotive companies under state control. Assessing the long-term benefits of such help and wei- ing the needs of different sectors against each other poses a major challenge for the national policies. Given the upcoming change of customer preferences and state regulations towards safety, sustainability and comfort of a car, the automotive industry is particularly called to prove its ability to make nec- sary innovations available in order to accelerate its pace to come out of the crisis. Co...
The Creative Crone
"Henneberg shows how these writers offer radically different but richly complementary strategies for breaking the silence surrounding age. Rich provides an approach to aging so strongly intertwined with other political issues that its complexity may keep us from immediately identifying age as one of her chief concerns. On the other hand, Sarton's direct treatment of aging sensitizes us to its importance and helps us see its significance in such writings as Rich's. Meanwhile, Rich's efforts to politicize age create stimulating contexts for Sarton's work. Henneberg explores elements of these writers' individual poems that develop themes of aging, including imagery and symbol, the construction of a persona, and the uses of rhythms to reinforce the themes. She also includes analyses of their fiction and nonfiction works and draws ideas from age studies by scholars such as Margaret Morganroth Gullette, Kathleen Woodward, and Thomas Cole."--From publisher description.
Handbook of 3D Integration, Volume 4
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
