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Microelectronics Packaging Handbook
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has ...
Microelectronics Packaging Handbook
Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.
Advanced Integrated Communication Microsystems
Learn the fundamentals of integrated communication microsystems Advanced communication microsystems—the latest technology to emerge in the semiconductor sector after microprocessors—require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration. This book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems fro...
Thin-Film Capacitors for Packaged Electronics
Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz), -Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.
Handbook of Conducting Polymers, Second Edition,
Discussing theory and transport, synthesis, processing, properties, and applications, this second edition of a standard resource covers advances in the field of electrically conducting polymers and contains more than 1500 drawings, photographs, tables, and equations. Maintaining the style of presentation and depth of coverage that made the first edition so popular, it contains the authoritative contributions of an interdisciplinary team of world-renowned experts encompassing the fields of chemistry, physics, materials science, and engineering. The Handbook of Conducting Polymers highlights progress, delineates improvements, and examines novel tools for polymer and materials scientists..
Nanopackaging
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Handbook of Microlithography, Micromachining, and Microfabrication: Micromachining and microfabrication
Contains useful process details, recipes, tables, charts and includes numerous device applications.
Borate Glasses
Boron Oxide plays a key role in numerous glasses of high technological importance, yet its role in glass structure is far from clear. Indeed, in recent years there have been serious chal lenges to previous structure concepts for both crystalline and glassy borates. These challenges were sufficient to warrant a re examination of the structure of borate glasses using the most pow erful tools currently available. To provide a suitable forum for this undertaking, a four-day conference on "Boron in Glass and Glass Ceramics" was convened at Alfred University, June 3-8, 1977 to review the best scientific thinking on structure and to debate conflicting views and discuss properties and applications o...
Encyclopedia of Packaging Materials, Processes, and Mechanics
"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection o...
