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This publication provides information about networking design for IBM® High Performance Computing (HPC) and AI for Power SystemsTM. This paper will help you understand the basic requirements when designing a solution, the components in an infrastructure for HPC and AI Systems, the designing of interconnect and data networks with use cases based in real life scenarios, the administration and the Out-Of-Band management networks. We cover all the necessary requirements, provide a good understanding of the technology and include examples for small, medium and large cluster environments. This paper is intended for IT architects, system designers, data center planners, and system administrators who must design or provide a solution for the infrastructure of a HPC cluster.
This book introduces advanced techniques for using PROC SQL in SAS. If you are a SAS programmer, analyst, or student who has mastered the basics of working with SQL, Advanced SQL with SAS® will help take your skills to the next level. Filled with practical examples with detailed explanations, this book demonstrates how to improve performance and speed for large data sets. Although the book addresses advanced topics, it is designed to progress from the simple and manageable to the complex and sophisticated. In addition to numerous tuning techniques, this book also touches on implicit and explicit pass-throughs, presents alternative SAS grid- and cloud-based processing environments, and compares SAS programming languages and approaches including FedSQL, CAS, DS2, and hash programming. Other topics include: Missing values and data quality with audit trails “Blind spots” like how missing values can affect even the simplest calculations and table joins SAS macro language and SAS macro programs SAS functions Integrity constraints SAS Dictionaries SAS Compute Server
This publication provides information about networking design for IBM® High Performance Computing (HPC) and AI for Power SystemsTM. This paper will help you understand the basic requirements when designing a solution, the components in an infrastructure for HPC and AI Systems, the designing of interconnect and data networks with use cases based in real life scenarios, the administration and the Out-Of-Band management networks. We cover all the necessary requirements, provide a good understanding of the technology and include examples for small, medium and large cluster environments. This paper is intended for IT architects, system designers, data center planners, and system administrators who must design or provide a solution for the infrastructure of a HPC cluster.
Silicon carbide is known to have been investigated since 1907 when Captain H J Round demonstrated yellow and blue emission by applying bias between a metal needle and an SiC crystal. The potential of using SiC in semiconductor electronics was already recognized half a century ago. Despite its well-known properties, it has taken a few decades to overcome the exceptional technological difficulties of getting silicon carbide material to reach device quality and travel the road from basic research to commercialization.This second of two volumes reviews four important additional areas: the growth of SiC substrates; the deep defects in different SiC polytypes, which after many years of research still define the properties of bulk SiC and the performance and reliability of SiC devices; recent work on SiC JFETs; and the complex and controversial issues important for bipolar devices.Recognized leaders in the field, the contributors to this volume provide up-to-date reviews of further state-of-the-art areas in SiC technology and materials and device research.
Die Arbeit ermittelt als Zielsetzung Ansatzpunkte dafür, wie Prozesse des Hochschul-Wissens- und Technologietransfers (WTT) erfolgreich gestaltet werden können. Sie beleuchtet Transferaktivitäten aus einer explizit marktorientierten Perspektive und leistet damit einen maßgeblichen Theoriebeitrag. Ausgehend von theoretischen Bezugsgrundlagen der Netzwerkanalyse, nationaler Innovationssysteme, der Wissenserzeugung „Mode 2“ sowie des Triple Helix-Konzepts wird ein konzeptioneller Bezugsrahmen für Hochschul-Wissens- und Technologietransfer erarbeitet. Auf dessen Grundlage sowie unter Hinzuziehung von Erkenntnissen (modell-)theoretischer Ausführungen zum Transfer und zu Aspekten des Dienstleistungsmarketing wird im nächsten Schritt ein modulares Transfergerüst zur Prozesserfassung und -abbildung entwickelt. Dessen Schwerpunkte werden im Rahmen zweier sich anschließender Empirien vertiefend betrachtet. Auf Basis der konzeptionellen und empirischen Erkenntnisse werden finale Thesen zur Optimierung des (Hochschul-)Wissens- und Technologietransfers im Sinne erfolgreicher Transferprozesse abgeleitet.
Silicon carbide is known to have been investigated since 1907 when Captain H J Round demonstrated yellow and blue emission by applying bias between a metal needle and an SiC crystal. The potential of using SiC in semiconductor electronics was already recognized half a century ago. Despite its well-known properties, it has taken a few decades to overcome the exceptional technological difficulties of getting silicon carbide material to reach device quality and travel the road from basic research to commercialization.This second of two volumes reviews four important additional areas: the growth of SiC substrates; the deep defects in different SiC polytypes, which after many years of research still define the properties of bulk SiC and the performance and reliability of SiC devices; recent work on SiC JFETs; and the complex and controversial issues important for bipolar devices.Recognized leaders in the field, the contributors to this volume provide up-to-date reviews of further state-of-the-art areas in SiC technology and materials and device research.
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