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Handbook of Wafer Bonding
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
2012
Particularly in the humanities and social sciences, festschrifts are a popular forum for discussion. The IJBF provides quick and easy general access to these important resources for scholars and students. The festschrifts are located in state and regional libraries and their bibliographic details are recorded. Since 1983, more than 659,000 articles from more than 30,500 festschrifts, published between 1977 and 2011, have been catalogued.
Empirical and Computational Explorations of Diffusion
Special topic volume with invited peer-reviewed papers only
Diffusion in Condensed Matter
This comprehensive, handbook-style survey of diffusion in condensed matter gives detailed insight into diffusion as the process of particle transport due to stochastic movement. It is understood and presented as a phenomenon of crucial relevance for a large variety of processes and materials. In this book, all aspects of the theoretical fundamentals, experimental techniques, highlights of current developments and results for solids, liquids and interfaces are presented.
The Physics of Semiconductors
Semiconductorelectronicsiscommonplaceineveryhousehold.Semiconductor deviceshavealsoenabledeconomicallyreasonable?ber-basedopticalcom- nication, optical storage and high-frequency ampli?cation and have recently revolutionizedphotography,displaytechnologyandlighting.Alongwiththese tremendous technological developments, semiconductors have changed the way we work, communicate, entertain and think. The technological progress of semiconductor materials and devices is evolving continuously with a large worldwide e?ort in human and monetary capital. For students, semicond- tors o?er a rich, diverse and exciting ?eld with a great tradition and a bright future. This book introduces students to semico...
Electrochemical Engineering for the 21st Century (Dedicated to Richard C. Alkire)
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Electrochemical Engineering for the 21st Century (dedicated to Richard C. Alkire)¿, held during the 217th meeting of The Electrochemical Society, in Vancouver, Canada, from April 25 to 30, 2010.
Silicon Materials Science and Technology X
This was the tenth symposium of the International Symposium on Silcon Material Science and Technology, going back to 1969. This issue provides a unique historical record of the program and will aid in the understanding of silicon materials over the last 35 years.
Thin Films and Coatings
The broad field of thin film technology is based first of all on the film growth processes in general. The concepts of crystal structure and defects in crystalline thin films such as grain boundaries, dislocations and vacancies are examined. The general nature of film growth from atoms equilibrating with the service, through the initial stages of growth to film coalescence and zone models is also within the scope of this book as are evaporation, sputter deposition and chemical vapour deposition. Thin films are widely used in microelectronics, chemistry and a wide array of related fields. This book offers new research in this exploding field.
