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Formal Methods
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Computer Safety, Reliability, and Security
This book constitutes the proceedings of the 39th International Conference on Computer Safety, Reliability and Security, SAFECOMP 2020, held in Lisbon, Portugal, in September 2020.* The 27 full and 2 short papers included in this volume were carefully reviewed and selected from 116 submissions. They were organized in topical sections named: safety cases and argumentation; formal verification and analysis; security modelling and methods; assurance of learning-enabled systems; practical experience and tools; threat analysis and risk mitigation; cyber-physical systems security; and fault injection and fault tolerance. *The conference was held virtually due to the COVID-19 pandemic. The chapter ‘Assurance Argument Elements for Off-the-Shelf, Complex Computational Hardware’ is available open access under an Open Government License 3.0 via link.springer.com.
Software Engineering in Health Care
This book constitutes revised selected papers from the jointly held conferences FHIES 2014, 4th International Symposium on Foundations of Health Information Engineering and Systems, and SEHC 2014, 6th International Workshop on Software Engineering in Health Care. The meeting took place in Washington, DC, USA, in July 2014. The 16 papers presented in this volume were carefully reviewed and selected from 23 submissions. They deal with security aspects of health information systems; medical devices in cyberphysical systems; the process of providing healthcare and of monitoring patients; and patient safety and the assurance of medical systems.
Innovative Technologies for Printing and Packaging
This book includes original, peer-reviewed research papers from the 13th China Academic Conference on Printing and Packaging (CACPP 2022), held in Jinan, China, on November 10-12, 2022. The proceedings cover the recent findings in color science and technology, image processing technology, digital media technology, mechanical and electronic engineering and numerical control, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book is of interest to university researchers, R&D engineers, and graduate students in the field of graphic arts, packaging, color science, image science, material science, computer science, digital media, network technology, and smart manufacturing technology.
Bridging the Gap Between AI and Reality
This book constitutes the proceedings of the First International Conference on Bridging the Gap between AI and Reality, AISoLA 2023, which took place in Crete, Greece, in October 2023. The papers included in this book focus on the following topics: The nature of AI-based systems; ethical, economic and legal implications of AI-systems in practice; ways to make controlled use of AI via the various kinds of formal methods-based validation techniques; dedicated applications scenarios which may allow certain levels of assistance; and education in times of deep learning.
Proceedings of the 8th International Conference on Financial Innovation and Economic Development (ICFIED 2023)
This is an open access book.Financial globalization plays a huge role in promoting the development of the world economy and the optimal allocation of world resources, stimulates the accelerated development of the international division of labor, and increases the international flow of production factors such as industrial transfer, capital transfer, and technology transfer. It enables developing countries to make up for the lack of their own capital and technology, and obtain industrial evolution, technological progress, and institutional innovation, thereby accelerating the speed of economic development; it also enables developed countries to open up cheap labor, raw material markets and br...
Computer Safety, Reliability, and Security. SAFECOMP 2022 Workshops
This book constitutes the proceedings of the Workshops held in conjunction with SAFECOMP 2022, which took place in Munich, Germany, in September 2022. The 23 full papers included in this volume were carefully reviewed and selected from 27 submissions. · 17th International ERCIM/EWICS/ARTEMIS Workshop on Dependable Smart Embedded Cyber-Physical Systems and Systems-of-Systems (DECSoS 2021) · 3rd International Workshop on Dependable Development-Operation Continuum Methods for Dependable Cyber-Physical System (DepDevOps 2022) · 9th International Workshop on Next Generation of System Assurance Approaches for Critical Systems (SASSUR 2022) · 1st International Workshop on Security and Safety Interaction (SENSEI 2022) · 3rd International Workshop on Underpinnings for Safe Distributed Artificial Intelligence (USDAI 2022) · 5th International Workshop on Artificial Intelligence Safety Engineering (WAISE 2022)
