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Energy Efficient Thermal Management of Data Centers
Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Heat Transfer Handbook
Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set)
Please click here for information on Set 1: Thermal Packaging Techniques Thermal and mechanical packaging -- the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. Successful thermal packaging is the key differentiator in electronic product...
Air Flow Management in Raised Floor Data Centers
The Brief discuss primarily two aspects of air flow management in raised floor data centers. Firstly, cooling air delivery through perforated tiles will be examined and influence of the tile geometry on flow field development and hot air entrainment above perforated tiles will be discussed. Secondly, the use of cold aisle containment to physically separate hot and cold regions, and minimize hot and cold air mixing will be presented. Both experimental investigations and computational efforts are discussed and development of computational fluid dynamics (CFD) based models for simulating air flow in data centers is included. In addition, metrology tools for facility scale air velocity and temperature measurement, and air flow rate measurement through perforated floor tiles and server racks are examined and the authors present thermodynamics-based models to gauge the effectiveness and importance of air flow management schemes in data centers.
Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Cooling of Microelectronic and Nanoelectronic Equipment
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excell...
Nano-Bio- Electronic, Photonic and MEMS Packaging
This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, su...
Nano-Bio- Electronic, Photonic and MEMS Packaging
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
NUMISHEET 2022
The NUMISHEET conference series is the most significant international conference on the area of the numerical simulation of sheet metal forming processes. It gathers the most prominent experts in numerical methods in sheet forming processes and is an outstanding forum for the exchange of ideas and for the discussion of technologies related to sheet metal forming processes. Topics covered in this volume include but are not limited to the following: Materials Modeling and Experimental Testing Methods Friction and Contact Formability, Necking, and Fracture Instabilities and Surface Defects Fracture and Damage Numerical Methods Springback Incremental Sheet Forming Roll Forming Innovative Forming Methods Product and Process Design and Optimization
