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Porous Fluids
Written by authoritative experts in the field, this book discusses fluid flow and transport phenomena in porous media. Portions of the book are devoted to interpretations of experimental results in this area and directions for future research. It is a useful reference for applied mathematicians and engineers, especially those working in the area of porous media.
Nano-Bio- Electronic, Photonic and MEMS Packaging
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Nano-Bio- Electronic, Photonic and MEMS Packaging
This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, su...
Fundamentals of Multiphase Heat Transfer and Flow
This textbook presents a modern treatment of fundamentals of heat and mass transfer in the context of all types of multiphase flows with possibility of phase-changes among solid, liquid and vapor. It serves equally as a textbook for undergraduate senior and graduate students in a wide variety of engineering disciplines including mechanical engineering, chemical engineering, material science and engineering, nuclear engineering, biomedical engineering, and environmental engineering. Multiphase Heat Transfer and Flow can also be used to teach contemporary and novel applications of heat and mass transfer. Concepts are reinforced with numerous examples and end-of-chapter problems. A solutions manual and PowerPoint presentation are available to instructors. While the book is designed for students, it is also very useful for practicing engineers working in technical areas related to both macro- and micro-scale systems that emphasize multiphase, multicomponent, and non-conventional geometries with coupled heat and mass transfer and phase change, with the possibility of full numerical simulation.
Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Advanced Packaging
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Heat Transfer Handbook
Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
Applied Computational Fluid Dynamics
"Describes the latest techniques and real-life applications of computational fluid dynamics (CFD) and heat transfer in aeronautics, materials processing and manufacturing, electronic cooling, and environmental control. Includes new material from experienced researchers in the field. Complete with detailed equations for fluid flow and heat transfer."
Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
