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Energy Efficient Thermal Management of Data Centers
Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Air Flow Management in Raised Floor Data Centers
The Brief discuss primarily two aspects of air flow management in raised floor data centers. Firstly, cooling air delivery through perforated tiles will be examined and influence of the tile geometry on flow field development and hot air entrainment above perforated tiles will be discussed. Secondly, the use of cold aisle containment to physically separate hot and cold regions, and minimize hot and cold air mixing will be presented. Both experimental investigations and computational efforts are discussed and development of computational fluid dynamics (CFD) based models for simulating air flow in data centers is included. In addition, metrology tools for facility scale air velocity and temperature measurement, and air flow rate measurement through perforated floor tiles and server racks are examined and the authors present thermodynamics-based models to gauge the effectiveness and importance of air flow management schemes in data centers.
Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set)
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic ...
Heat Transfer Handbook
Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Fundamentals of Multiphase Heat Transfer and Flow
This textbook presents a modern treatment of fundamentals of heat and mass transfer in the context of all types of multiphase flows with possibility of phase-changes among solid, liquid and vapor. It serves equally as a textbook for undergraduate senior and graduate students in a wide variety of engineering disciplines including mechanical engineering, chemical engineering, material science and engineering, nuclear engineering, biomedical engineering, and environmental engineering. Multiphase Heat Transfer and Flow can also be used to teach contemporary and novel applications of heat and mass transfer. Concepts are reinforced with numerous examples and end-of-chapter problems. A solutions manual and PowerPoint presentation are available to instructors. While the book is designed for students, it is also very useful for practicing engineers working in technical areas related to both macro- and micro-scale systems that emphasize multiphase, multicomponent, and non-conventional geometries with coupled heat and mass transfer and phase change, with the possibility of full numerical simulation.
Advanced Packaging
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-volume Set)
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 2, please visit Set 1: Thermal Packaging Techniques and Set 2: Thermal Packaging Tools /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic pro...
