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This book discusses advances in functional thin films for sensors and novel concepts for future breakthroughs. The focus is on guidelines and design rules for sensor systems, interaction between functional thin films and other sensor subsystems, fundamentals behind the intrinsic functionality in sensing thin films and nanostructures, state-of-the-art technologies used to develop sensors today and concrete examples of sensor designs.
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
This book summarizes the findings of scientific research studies to provide readers with straightforward information on a wide variety of healthy habits and the factors that may make them difficult to follow. How can taking a yearly vacation serve to improve your health? Is there any scientific proof that skipping breakfast is detrimental to one's health? Americans are constantly bombarded with health tips from magazines, television, the Internet, and other media, but much of this information can be inaccurate. The 50 Healthiest Habits and Lifestyle Changes provides authoritative, research-based information on habits that are important for everyone, but especially teens and young adults. Thi...
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal design...