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Compact Hierarchical Bipolar Transistor Modeling with Hicum
Compact Hierarchical Bipolar Transistor Modeling with HICUM will be of great practical benefit to professionals from the process development, modeling and circuit design community who are interested in the application of bipolar transistors, which include the SiGe:C HBTs fabricated with existing cutting-edge process technology. The book begins with an overview on the different device designs of modern bipolar transistors, along with their relevant operating conditions; while the subsequent chapter on transistor theory is subdivided into a review of mostly classical theories, brought into context with modern technology, and a chapter on advanced theory that is required for understanding modern device designs. This book aims to provide a solid basis for the understanding of modern compact models.
Wafer Fabrication: Factory Performance and Analysis
This book is concerned with wafer fabrication and the factories that manufacture microprocessors and other integrated circuits. With the invention of the transistor in 1947, the world as we knew it changed. The transistor led to the microprocessor, and the microprocessor, the guts of the modern computer, has created an epoch of virtually unlimited information processing. The electronics and computer revolution has brought about, for better or worse, a new way of life. This revolution could not have occurred without wafer fabrication, and its associated processing technologies. A microprocessor is fabricated via a lengthy, highly-complex sequence of chemical processes. The success of modern c...
The Physics of SiO2 and Its Interfaces
The Physics of SiO2 and Its Interfaces covers the proceedings of the International Topical Conference on the Physics of SiO2 and its Interfaces, held at the IBM Thomas J. Watson Research Center, Yorktown Heights, New York on March 22-24, 1978. The book focuses on the properties, reactions, transformations, and structures of silicon dioxide (SiO2). The selection first discusses the electronic properties of vitreous SiO2 and small polaron formation and motion of holes in a-SiO2. Discussions focus on mobility edges and polarons, deep states in the gap, and excitons. The text also ponders on field-dependent hole and exciton transport in SiO2 and electron emission from SiO2 into vacuum. The publication takes a look at the electronic structures of crystalline and amorphous SiO2; band structures and electronic properties of SiO2; and optical absorption spectrum of SiO2. The text also tackles chemical bond and related properties of SiO2; topological effects on the band structure of silica; and properties of localized SiO2 clusters in layers of disordered silicon on silver. The selection is a good reference for physicists and readers interested in the physics of silicon dioxide.
Electromigration in ULSI Interconnections
Electromigration in ULSI Interconnections provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based inter...
BSIM4 and MOSFET Modeling for IC Simulation
This book presents the art of advanced MOSFET modeling for integrated circuit simulation and design. It provides the essential mathematical and physical analyses of all the electrical, mechanical and thermal effects in MOS transistors relevant to the operation of integrated circuits. Particular emphasis is placed on how the BSIM model evolved into the first ever industry standard SPICE MOSFET model for circuit simulation and CMOS technology development. The discussion covers the theory and methodology of how a MOSFET model, or semiconductor device models in general, can be implemented to be robust and efficient, turning device physics theory into a production-worthy SPICE simulation model. Special attention is paid to MOSFET characterization and model parameter extraction methodologies, making the book particularly useful for those interested or already engaged in work in the areas of semiconductor devices, compact modeling for SPICE simulation, and integrated circuit design.
Logic Non-volatile Memory
Would you like to add the capabilities of the Non-Volatile Memory (NVM) as a storage element in your silicon integrated logic circuits, and as a trimming sector in your high voltage driver and other silicon integrated analog circuits? Would you like to learn how to embed the NVM into your silicon integrated circuit products to improve their performance? This book is written to help you. It provides comprehensive instructions on fabricating the NVM using the same processes you are using to fabricate your logic integrated circuits. We at our eMemory company call this technology the embedded Logic NVM. Because embedded Logic NVM has simple fabrication processes, it has replaced the conventional...
Makers of the Microchip
The first years of the company that developed the microchip and created the model for a successful Silicon Valley start-up. In the first three and a half years of its existence, Fairchild Semiconductor developed, produced, and marketed the device that would become the fundamental building block of the digital world: the microchip. Founded in 1957 by eight former employees of the Schockley Semiconductor Laboratory, Fairchild created the model for a successful Silicon Valley start-up: intense activity with a common goal, close collaboration, and a quick path to the market (Fairchild's first device hit the market just ten months after the company's founding). Fairchild Semiconductor was one of ...
First International Congress on Adhesion Science And Technology---invited Papers
This Festschrift documents the Proceedings of the First International Congress on Adhesion Science and Technology, held in honor of Dr. Kash Mittal on the occasion of his 50 birthday, in Amsterdam, The Netherlands, October 16-20, 1995. It contains the full accounts of the plenary and invited lectures, which are divided into the following seven parts: Part 1: Fundamental aspects of adhesion and general topics; Part 2: Contact angle, wettability and surface energetics; Part 3: Surface modification: Relevance to adhesion; Part 4: Adhesives and adhesive joints; Part 5: Adhesion aspects of polymeric coatings, and polymer-polymer interphase; Part 6: Metal-polymer and metal-ceramic adhesion; and Part 7: General papers. The topics covered include many different aspects of adhesion science and technology, and both fundamental and applied issues are addressed. The final section of this volume gives a listing of titles, authors and affiliations of the other 185 papers which were included in the technical program of the conference.
An Engineer's Alphabet
Written by America's most famous engineering storyteller and educator, this abecedarium is one engineer's selection of thoughts, quotations, anecdotes, facts, trivia and arcana relating to the practice, history, culture and traditions of his profession. The entries reflect decades of reading, writing, talking and thinking about engineers and engineering, and range from brief essays to lists of great engineering achievements. This work is organized alphabetically and more like a dictionary than an encyclopedia. It is not intended to be read from first page to last, but rather to be dipped into, here and there, as the mood strikes the reader. In time, it is hoped, this book should become the source to which readers go first when they encounter a vague or obscure reference to the softer side of engineering.
