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Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, w...
Electromagnetism
This book is dedicated to the study of the theory of electromagnetism. It is not intended to cover all aspects of the topic, but instead will give a certain perspective, that of its relationship with special relativity. Indeed, special relativity is intrinsic to electromagnetism; thus, this paradigm eliminates some false paradoxes. Electromagnetism also discusses the limit of classical mechanics, and covers problems that arise when phenomena related to the propagation of electromagnetic waves are encountered. These are problems that even the greatest scientists of the last two hundred years have not been able to entirely overcome. This book is directed towards the undergraduate level, and will also support the readers as they move on to advanced technical training, such as an engineering or master’s degree.
Smart Power Integration
Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned. This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques. Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT); and monolithic integration, specifically through the paradigm of functional integration. Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.
Analog Devices and Circuits 2
At the end of the Second World War, a new technological trend was born: integrated electronics. This trend relied on the enormous rise of integrable electronic devices. Analog Devices and Circuits is composed of two volumes: the first deals with analog components, and the second with associated analog circuits. The goal here is not to create an overly comprehensive analysis, but rather to break it down into smaller sections, thus highlighting the complexity and breadth of the field. This first volume, after a brief history, describes the two main devices, namely bipolar transistors and MOS, with particular importance given to the modeling aspect. In doing so, we deal with new devices dedicated to radio frequency, which touches on nanoelectronics. We will also address some of the notions related to quantum mechanics. Finally, Monte Carlo methods, by essence statistics, will be introduced, which have become more and more important since the middle of the twentieth century. The second volume deals with the circuits that "use" the analog components that were introduced in Volume 1. Here, a particular emphasis is placed on the main circuit: the operational amplifier.
Digital Communication Techniques
There have been considerable developments in information and communication technology. This has led to an increase in the number of applications available, as well as an increase in their variability. As such, it has become important to understand and master problems related to establishing radio links, the layout and flow of source data, the power available from antennas, the selectivity and sensitivity of receivers, etc. This book discusses digital modulations, their extensions and environment, as well as a few basic mathematical tools. An understanding of degree level mathematics or its equivalent is a prerequisite to reading this book. Digital Communication Techniques is aimed at licensed professionals, engineers, Masters students and researchers whose field is in related areas such as hardware, phase-locked loops, voltage-controlled oscillators or phase noise.
Analog Devices and Circuits 1
At the end of the Second World War, a new technological trend was born: integrated electronics. This trend relied on the enormous rise of integrable electronic devices. Analog Devices and Circuits is composed of two volumes: the first deals with analog components, and the second with associated analog circuits. The goal here is not to create an overly comprehensive analysis, but rather to break it down into smaller sections, thus highlighting the complexity and breadth of the field. This first volume, after a brief history, describes the two main devices, namely bipolar transistors and MOS, with particular importance given to the modeling aspect. In doing so, we deal with new devices dedicated to radio frequency, which touches on nanoelectronics. We will also address some of the notions related to quantum mechanics. Finally, Monte Carlo methods, by essence statistics, will be introduced, which have become more and more important since the middle of the twentieth century. The second volume deals with the circuits that "use" the analog components that were introduced in Volume 1. Here, a particular emphasis is placed on the main circuit: the operational amplifier.
Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D
The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) sepa...
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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Micro-nanoelectronics Devices
Micro-nanoelectronics Devices: Modeling of Diffusion and Operation Processes concentrates on the modeling of diffusion processes and the behavior of modern integrated components, from material, to architecture. It goes through the process, the device and the circuit regarding today's widely discussed nano-electronics, both from an industry perspective and that of public entities. - Seeks to provide the core of modeling in micro (nano) electronics - Introduces the equations underlying the modelizations and, ultimately, the related simulations - Proposes what modifications should be made with respect to modeling
