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Metallurgy
In recent decades scientists and engineers around the globe have been responding to the requirement of high performance materials through innovative material research and engineering. The ever increasing demand on quality and reliability has resulted in some dazzling technological achievements in the area of advanced materials and manufacturing. The purpose of this book is to bring together significant findings of leading experts, in developing and improving the technology that supports advanced materials and process development. From gold nano-structures to advanced superalloys, this book covers investigations involving modern computer based approaches as well as traditional experimental techniques. Selected articles include research findings on advances made in materials that are used not only in complex structures such as aeroplanes but also in clinical treatments. It is envisaged that it will promote knowledge transfer across the materials society including university students, engineers and scientists to built further understanding of the subject.
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of...
Circuits and Systems for Security and Privacy
Circuits and Systems for Security and Privacy begins by introducing the basic theoretical concepts and arithmetic used in algorithms for security and cryptography, and by reviewing the fundamental building blocks of cryptographic systems. It then analyzes the advantages and disadvantages of real-world implementations that not only optimize power, area, and throughput but also resist side-channel attacks. Merging the perspectives of experts from industry and academia, the book provides valuable insight and necessary background for the design of security-aware circuits and systems as well as efficient accelerators used in security applications.
CMOS
CMOS: Front-End Electronics for Radiation Sensors offers a comprehensive introduction to integrated front-end electronics for radiation detectors, focusing on devices that capture individual particles or photons and are used in nuclear and high energy physics, space instrumentation, medical physics, homeland security, and related fields. Emphasizing practical design and implementation, this book: Covers the fundamental principles of signal processing for radiation detectors Discusses the relevant analog building blocks used in the front-end electronics Employs systematically weak and moderate inversion regimes in circuit analysis Makes complex topics such as noise and circuit-weighting functions more accessible Includes numerical examples where appropriate CMOS: Front-End Electronics for Radiation Sensors provides specialized knowledge previously obtained only through the study of multiple technical and scientific papers. It is an ideal text for students of physics and electronics engineering, as well as a useful reference for experienced practitioners.
Carbon Nanotube Electronics
This book provides a complete overview of the field of carbon nanotube electronics. It covers materials and physical properties, synthesis and fabrication processes, devices and circuits, modeling, and finally novel applications of nanotube-based electronics. The book introduces fundamental device physics and circuit concepts of 1-D electronics. At the same time it provides specific examples of the state-of-the-art nanotube devices.
Major Companies of The Far East and Australasia 1990/91
This book represents the seventh edition of what has become an established reference work, MAJOR COMPANIES OF THE FAR EAST & AUSTRALASIA. This volume has been carefully researched and updated since publication of the sixth edition, and provides more company data on the most important companies in the region. The information in the book was submitted mostly by the companies themselves, completely free of charge. For the first time, a third volume has been added to the series, covering major companies in Australia and New Zealand. The companies listed have been selected on the grounds of the size of their sales volume or balance sheet or their importance to the business environment of the coun...
Official Gazette
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Handbook of Wafer Bonding
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Directory
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3D Integration for VLSI Systems
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
