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ISTFA 2012
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Microelectronics Fialure Analysis Desk Reference, Seventh Edition
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat...
Transdex Index
An index to translations issued by the United States Joint Publications Research Service (JPRS).
Microelectronics Failure Analysis
Includes bibliographical references and index.
Proceedings
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ISTFA 2000
Proceedings of the 2000 International Symposium for Testing and Failure Analysis, held 12th-16th November, 2000, at Meydenbauer Convention Center, Belvue, Washington. These proceedings present in-depth coverage of the latest developments and the most advanced techniques for testing and failure analysis of microelectronic components. The book covers the full spectrum of failure analysis topics, but with special emphasis on backside (flipchip) failure analysis and the diagnosis of high-end microchip failures, by analyzing the silicon. Contents: Advanced Techniques; Packaging; Testing and Yield Enhancement; Backside Analysis; New Techniques; Case Histories; Focused Ion Beam Analysis; Scanning Probe Microscopy Analysis. The CD-ROMAs PDF-file format can be accessed using Adobe Acrobat Reader 4.0 or higher.
How to Organize and Run a Failure Investigation
Learning the proper steps for organizing a failure investigation ensures success. Failure investigations cross company functional boundaries and are an integral component of any design or manufacturing business operation. Well-organized and professionally conducted investigations are essential for solving manufacturing problems and assisting in redesigns. This book outlines a proven systematic approach to failure investigation. It explains the relationship between various failure sources (corrosion, for example) and the organization and conduct of the investigation. It provides a learning platform for engineers from all disciplines: materials, design, manufacturing, quality, and management. The examples in this book focus on the definition of and requirements for a professionally performed failure analysis of a physical object or structure. However, many of the concepts have much greater utility than for investigating the failure of physical objects. For example, the book provides guidance in areas such as learning how to define objectives, negotiating the scope of investigation, examining the physical evidence, and applying general problem-solving techniques.
Swarm Intelligence for Electric and Electronic Engineering
"This book provides an exchange of knowledge on the advances, discoveries and improvements of swarm intelligence in electric and electronic engineering, bringing together new swarm-based algorithms and their effect on complex problems and various real-world applications"--
Nickel, Cobalt, and Their Alloys
This book is a comprehensive guide to the compositions, properties, processing, performance, and applications of nickel, cobalt, and their alloys. It includes all of the essential information contained in the ASM Handbook series, as well as new or updated coverage in many areas in the nickel, cobalt, and related industries.
Microelectronics Failure Analysis
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
