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Atomic Layer Deposition Applications 4
  • Language: en
  • Pages: 379

Atomic Layer Deposition Applications 4

The continuously expanding realm of Atomic Layer Deposition (ALD) Applications is the symposium focus. ALD can enable the precise deposition of ultra-thin, highly conformal coatings over complex 3D topography, with controlled composition and properties. This issue of the ECS Transactions contains peer reviewed papers presented at the symposium. Breadths of ALD Applications are featured: novel nano-composites and nanostructures, dielectrics for state-of-the-art transistors and capacitors, optoelectronics and a variety of other emerging applications.

Semiconductor Wafer Bonding VIII : Science, Technology, and Applications
  • Language: en
  • Pages: 476
Semiconductor Wafer Bonding : Science, Technology, and Applications V
  • Language: en
  • Pages: 496
Evaluation of Ocean-Energy Conversion Based on Linear Generator Concepts
  • Language: en
  • Pages: 169

Evaluation of Ocean-Energy Conversion Based on Linear Generator Concepts

  • Type: Book
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  • Published: 2012-06
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  • Publisher: AuthorHouse

It is shown theoretically that the buoy can be designed to have a greater heave response than that of the height of a passing wave resulting in an increase in generated power from the linear generator.

Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
  • Language: en
  • Pages: 656

Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele

Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.

NASA Tech Briefs
  • Language: en
  • Pages: 68

NASA Tech Briefs

  • Type: Book
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  • Published: 2017-08
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  • Publisher: Unknown

None

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding
  • Language: en
  • Pages: 636
Semiconductor Wafer Bonding 10: Science, Technology, and Applications
  • Language: en
  • Pages: 588

Semiconductor Wafer Bonding 10: Science, Technology, and Applications

This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.

Advances in Microfluidics
  • Language: en
  • Pages: 424

Advances in Microfluidics

Increasing innovations and applications make microfluidics a versatile choice for researchers in many disciplines. This book consists of multiple review chapters that aim to cover recent advances and new applications of microfluidics in biology, electronics, energy, and materials sciences. It provides comprehensive views of various aspects of microfluidics ranging from fundamentals of fabrication, flow control, and droplet manipulation to the most recent exploration in emerging areas such as material synthesis, imaging and novel spectroscopy, and marriage with electronics. The chapters have many illustrations showcasing exciting results. This book should be useful for those who are eager to learn more about microfluidics as well as researchers who want to pick up new concepts and developments in this fast-growing field.

Atomic Layer Deposition Applications 11
  • Language: en
  • Pages: 281