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Wireless Power Transfer is the second edition of a well received first book, which published in 2012. It represents the state-of-the-art at the time of writing, and addresses a unique subject of great international interest in terms of research. Most of the chapters are contributed by the main author, though as in the first edition several chapters are contributed by other authors. The authors of the various chapters are experts in their own right on the specific topics within wireless energy transfer. Compared to the first edition, this new edition is more comprehensive in terms of the concepts discussed, and the range of current industrial applications which are presented, such as those of...
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
This volume contains papers presented at the Eleventh International Conference on Ultrafast Phenomena held at Garmisch-Partenkirchen, Germany, from July 12 to 17, 1998. The biannual Ultrafast Phenomena Conferences provide a forum for dis cussion of the latest advances in ultrafast optics and their applications in science and engineering. The Garmisch conference brought together a multidisciplinary group of 440 participants from 27 countries, including 127 students. The enthu siasm of this large number of Participants, the high quality of the papers they presented and the magnificent conference site resulted in a successful and pleasant conference. Progress was reported in the technology of g...
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
This book targets engineers and researchers familiar with basic computer architecture concepts who are interested in learning about on-chip networks. This work is designed to be a short synthesis of the most critical concepts in on-chip network design. It is a resource for both understanding on-chip network basics and for providing an overview of state of-the-art research in on-chip networks. We believe that an overview that teaches both fundamental concepts and highlights state-of-the-art designs will be of great value to both graduate students and industry engineers. While not an exhaustive text, we hope to illuminate fundamental concepts for the reader as well as identify trends and gaps ...
The purpose of this book is two-fold. First, the various different methods of accessing the THz range are discussed, with a view to convince the reader that there have been qualitative and significant improvements over older, more conventional techniques. The text makes it clear that these improvements enable practical "real-world" applications of THz technology, in a manner which would not have been possible before. Second, the demonstrations and feasibility tests described serve as compelling evidence of the utility of such devices. Due to the unique characteristics of THz radiation and its interaction with materials, these devices have substantial advantages over other competing technologies in a number of different areas.
This book describes the structured design and optimization of efficient, energy processing integrated circuits. The approach is multidisciplinary, covering the monolithic integration of IC design techniques, power electronics and control theory. In particular, this book enables readers to conceive, synthesize, design and implement integrated circuits with high-density high-efficiency on-chip switching power regulators. Topics covered encompass the structured design of the on-chip power supply, efficiency optimization, IC-compatible power inductors and capacitors, power MOSFET switches and efficient switch drivers in standard CMOS technologies.
This book presents the latest advances in ultrafast science, including ultrafast laser and measurement technology, and studies of ultrafast phenomena. It summarizes the results presented at the 12th Ultrafast Phenomena Conference and reviews the state of the art of this important and rapidly advancing field.
Functionalized magnetic nanomaterials are used in data storage, biomedical, environmental, and heterogeneous catalysis applications but there remain developmental challenges to overcome. Nanostructured Magnetic Materials: Functionalization and Diverse Applications covers different synthesis methods for magnetic nanomaterials and their functionalization strategies and highlights recent progress, opportunities, and challenges to utilizing these materials in real-time applications. Reviews recent progress made in the surface functionalization of magnetic nanoparticles Discusses physico-chemical characterization and synthesis techniques Presents the effect of the external magnetic field Details biological, energy, and environmental applications as well as future directions This reference will appeal to researchers, professionals, and advanced students in materials science and engineering and related fields.
Pivotal to Asia's future will be the robustness of its medical universities. Lessons learned in the past and the challenges facing these schools in the future are outlined in this collection, which offers valuable insights for other medical education systems as well. The populations in these rapidly growing countries rely on healthcare systems that can vigorously respond to the concerns of shifting demographics, disease, and epidemics. The collected works focus on the education of physicians and health professionals, policy debates, cooperative efforts, and medical education reform movements.