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Electrical Design of Through Silicon Via
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Wireless Power Transfer
Nikola Tesla's dream in the early 20th century of a "World Wireless System" led him to build the Wardenclyffe Tower, a prototype base station serving as an emitter for his "World Wireless System". The base station was to supply wireless electrical energy to a distant receiver. This book builds upon that dream and is a result of intensive research interest in powerline, machine to machine communications and wireless power transfer globally. Wireless energy transfer or Witricity (WIreless elecTRICITY) transfers electricity instead of data. The technology is useful in cases where instantaneous or continuous energy is needed but interconnecting wires are inconvenient, hazardous, or impossible. T...
On-Chip Networks, Second Edition
This book targets engineers and researchers familiar with basic computer architecture concepts who are interested in learning about on-chip networks. This work is designed to be a short synthesis of the most critical concepts in on-chip network design. It is a resource for both understanding on-chip network basics and for providing an overview of state of-the-art research in on-chip networks. We believe that an overview that teaches both fundamental concepts and highlights state-of-the-art designs will be of great value to both graduate students and industry engineers. While not an exhaustive text, we hope to illuminate fundamental concepts for the reader as well as identify trends and gaps ...
Ultrafast Phenomena XI
This volume contains papers presented at the Eleventh International Conference on Ultrafast Phenomena held at Garmisch-Partenkirchen, Germany, from July 12 to 17, 1998. The biannual Ultrafast Phenomena Conferences provide a forum for dis cussion of the latest advances in ultrafast optics and their applications in science and engineering. The Garmisch conference brought together a multidisciplinary group of 440 participants from 27 countries, including 127 students. The enthu siasm of this large number of Participants, the high quality of the papers they presented and the magnificent conference site resulted in a successful and pleasant conference. Progress was reported in the technology of g...
Sensing with Terahertz Radiation
The purpose of this book is two-fold. First, the various different methods of accessing the THz range are discussed, with a view to convince the reader that there have been qualitative and significant improvements over older, more conventional techniques. The text makes it clear that these improvements enable practical "real-world" applications of THz technology, in a manner which would not have been possible before. Second, the demonstrations and feasibility tests described serve as compelling evidence of the utility of such devices. Due to the unique characteristics of THz radiation and its interaction with materials, these devices have substantial advantages over other competing technologies in a number of different areas.
Design And Modeling For 3d Ics And Interposers
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Nanostructured Magnetic Materials
Functionalized magnetic nanomaterials are used in data storage, biomedical, environmental, and heterogeneous catalysis applications but there remain developmental challenges to overcome. Nanostructured Magnetic Materials: Functionalization and Diverse Applications covers different synthesis methods for magnetic nanomaterials and their functionalization strategies and highlights recent progress, opportunities, and challenges to utilizing these materials in real-time applications. Reviews recent progress made in the surface functionalization of magnetic nanoparticles Discusses physico-chemical characterization and synthesis techniques Presents the effect of the external magnetic field Details biological, energy, and environmental applications as well as future directions This reference will appeal to researchers, professionals, and advanced students in materials science and engineering and related fields.
CMOS Integrated Switching Power Converters
This book describes the structured design and optimization of efficient, energy processing integrated circuits. The approach is multidisciplinary, covering the monolithic integration of IC design techniques, power electronics and control theory. In particular, this book enables readers to conceive, synthesize, design and implement integrated circuits with high-density high-efficiency on-chip switching power regulators. Topics covered encompass the structured design of the on-chip power supply, efficiency optimization, IC-compatible power inductors and capacitors, power MOSFET switches and efficient switch drivers in standard CMOS technologies.
Electrical Engineering And Automation - Proceedings Of The International Conference On Electrical Engineering And Automation (Eea2016)
2016 International Conference on Electrical Engineering and Automation (EEA2016) was held in Hong Kong, China from June 24th–26th, 2016. EEA2016 has provided a platform for leading academic scientists, researchers, scholars and students around the world, to get together to compare notes, and share their results and findings, in areas of Electronics Engineering and Electrical Engineering, Materials and Mechanical Engineering, Control and Automation Modeling and Simulation, Testing and Imaging, Robotics, Actuating and Sensoring. The conference had received a total of 445 submissions. However, after peer review by the Technical Program Committee only 129 were selected to be included in this conference proceedings; based on their originality, ability to test ideas, and contribution to the understanding and advancement in Electronics and Electrical Engineering.
