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The Dow Corning case raised serious questions about the safety of silicone breast implants and about larger issues of medical device testing and patient education. Safety of Silicone Breast Implants presents a well-documented, thoughtful exploration of the safety of these devices, drawing conclusions from the available research base and suggesting further questions to be answered. This book also examines the sensitive issues surrounding women's decisions about implants. In reaching conclusions, the committee reviews: The history of the silicone breast implant and the development of its chemistry. The wide variety of U.S.-made implants and their regulation by the Food and Drug Administration. Frequency and consequences of local complications from implants. The evidence for and against links between implants and autoimmune disorders, connective tissue disease, neurological problems, silicone in breast milk, or a proposed new syndrome. Evidence that implants may be associated with lower frequencies of breast cancer. Safety of Silicone Breast Implants provides a comprehensive, well-organized review of the science behind one of the most significant medical controversies of our time.
The aim of this major reference work is to provide a first point of entry to the literature for the researchers in any field relating to structural integrity in the form of a definitive research/reference tool which links the various sub-disciplines that comprise the whole of structural integrity. Special emphasis will be given to the interaction between mechanics and materials and structural integrity applications. Because of the interdisciplinary and applied nature of the work, it will be of interest to mechanical engineers and materials scientists from both academic and industrial backgrounds including bioengineering, interface engineering and nanotechnology. The scope of this work encomp...
Reinforced plastics are becoming widely adopted for long-term structural use-in everything from buildings and bridges to boats and swimming pools. However, the lifetimes being sought are far greater than the whole history of reinforced plastics production! Reinforced Plastics Durability explores the strength and weathering characteristics which make the material ideal for numerous applications, but also alerting the user of wear and corrosion-with studies of the processes and mechanisms which cause the deterioration. Written especially for first-time users of reinforced plastics-engineers, designers, and managers alike-Reinforced Plastics Durability offers substantial introductory informatio...
Polymer composites represent materials of great and of continuously growing importance. Their potential for application appears to be limitless. They have been the subject of numerous studies both at academic and industrial levels. Much progress has been made in the incisive formulation of composites; sophisticated methods of property evaluation have been developed in the past decade and many, largely empirical solutions have been proposed to resolve the problem of their long-term performance under typical conditions of use (i. e. the use of silane or titane coupling agents to enhance adhesion within composite materials). Assuredly one of the most essential factors in the performance of these systems is the condition of the interface and interphase among the constituents of a given system. It has become clear that it is the interface/interphase, and the interactions which take place in this part of a system, which determine to a significant degree the initial properties of the material. In order to achieve leadership in the formulation and application of polymer composites, it is evident that in depth understanding of interfacial and interphase phenomena becomes a prerequisite.
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors - Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science - Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Finding and slzmg cracks and other crack-like discontinuities has been the center of attention for scientists and engineers developing and using nondestructive evaluation (NDE) technology. However, with advanced mate rials being "engineered" and used in critical structural components, a new for NDE has emerged. Whereas many traditional engineering materi challenge als fail due to the initiation and self-similar propagation of a crack, reinforced composite materials degrade and fail in a manner more analogously to the collapse of a structure. Consequently the NDE of such materials involves assessing the combined effect of the material's damaged condition rather than identifying and sizing sin...