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We are facing a global energy crisis caused by world population growth, an escalating increase in demand, and continued dependence on fossil-based fuels for generation. It is widely accepted that increases in greenhouse gas concentration levels, if not reversed, will result in major changes to world climate with consequential effects on our society and economy. This is just the kind of intractable problem that Purdue University's Global Policy Research Institute seeks to address in the Purdue Studies in Public Policy series by promoting the engagement between policy makers and experts in fields such as engineering and technology. Major steps forward in the development and use of technology a...
The end of dramatic exponential growth in single-processor performance marks the end of the dominance of the single microprocessor in computing. The era of sequential computing must give way to a new era in which parallelism is at the forefront. Although important scientific and engineering challenges lie ahead, this is an opportune time for innovation in programming systems and computing architectures. We have already begun to see diversity in computer designs to optimize for such considerations as power and throughput. The next generation of discoveries is likely to require advances at both the hardware and software levels of computing systems. There is no guarantee that we can make parall...
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Sustainable development encompasses economic, social, and ecological perspectives of conservation and change in natural resources. It is generally defined as development that meets the needs of the present without compromising the ability of future generations to meet their own needs. This definition is based on the ethical imperative of equity within and between generations. Moreover, apart from meeting; "the basic needs of all"; sustainable development implies sustaining the natural life support systems on Earth, and extending to all the opportunity to satisfy their aspirations for a better life. Hence, sustainable development is more precisely defined as a process of change in which the e...
This book presents and facilitates the interchange of new research and development results concerned with hot topics in thermoelectric generators (TEGs) research, development and production. Topics include prospective thermoelectric materials for manufacturing TEGs operating in low-, mid-, and high temperature ranges, thermal and mechanical degradation issues in prospective thermoelectric materials and TEG modules, theoretical study of novel inorganic and organic thermoelectric materials, novel methods and apparatus for measuring performance of thermoelectric materials and TEGs, and thermoelectric power generators simulation, modeling, design and practice.This book helps researchers tackle the challenges that still remain in creating cheap and effective TEGs and presents the latest trends and technologies in development and production of advanced thermoelectric generation devices. Provides a concentration of new research and development in the field of Thermoelectric energy generation; Facilitates the interchange of new ideas and results to react effectively to the challenges of Thermoelectric generators; Explains both the advancements and challenges in TEGs.
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
This dissertation demonstrates that graphics processors (GPUs) as representatives of emerging many-core architectures are very well-suited for the fast and accurate solution of large, sparse linear systems of equations, using parallel multigrid methods on heterogeneous compute clusters. Such systems arise for instance in the discretisation of (elliptic) partial differential equations with finite elements. Fine-granular parallelisation techniques and methods to ensure accuracy are developed that enable at least one order of magnitude speedup over highly-tuned conventional CPU implementations, without sacrificing neither accuracy nor functionality.
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.