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Thermal Management of Microelectronic Equipment
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Thermal Management of Telecommunications Equipment
This is a comprehensive book that addresses both thermal and mechanical reliabilities as well as energy efficiency in the design of all types of telecommunications equipment, including indoor and outdoor systems. This book places a great deal of emphasis on providing practical solutions to thermal issues facing today's telecommunications industry. Materials presented in the book are based on actual cases in design of all types of telecommunications equipment. This book is developed to serve many types of readers. For graduate students, this book will guide them with practical approaches to solve real world problems that are of vast complexity. For professional engineers, this book will provide them with valuable and resourceful references.
Thermal Design of Liquid Cooled Microelectronic Equipment
"With the demands of increased system functionalities and performance, the system power density of microelectronics equipment is continuously increased at a fast pace. This is especially true for the telecommunications systems because the network traffic in the industry has grown very rapidly every year. For the high power air cooled systems, large high performance fans are becoming a must for the systems in order to provide the necessary air flow rates. Two major concerns about these large fans are the power consumption and the acoustic noise of the fans. In addition, the increase in the system power results in a significant increase in the operation cost of the equipment as well as its host facilities such as the date centers. Liquid cooling can not only resolve the above mentioned issues related to high power air-cooled systems but also enhance its system performance and reliability. For some cases, the system power is too high to be cooled by air thermally. The only solution to such situations is adopting the liquid cooling"--
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Journal of Tribology
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Thermal Management for Opto-electronics Packaging and Applications
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this a...
