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Introduction to Focused Ion Beams
Introduction to Focused Ion Beams is geared towards techniques and applications. This is the only text that discusses and presents the theory directly related to applications and the only one that discusses the vast applications and techniques used in FIBs and dual platform instruments.
Biological Field Emission Scanning Electron Microscopy, 2 Volume Set
The go‐to resource for microscopists on biological applications of field emission gun scanning electron microscopy (FEGSEM) The evolution of scanning electron microscopy technologies and capability over the past few years has revolutionized the biological imaging capabilities of the microscope—giving it the capability to examine surface structures of cellular membranes to reveal the organization of individual proteins across a membrane bilayer and the arrangement of cell cytoskeleton at a nm scale. Most notable are their improvements for field emission scanning electron microscopy (FEGSEM), which when combined with cryo-preparation techniques, has provided insight into a wide range of bi...
ISTFA 2014
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Scanning Microscopy for Nanotechnology
This book presents scanning electron microscopy (SEM) fundamentals and applications for nanotechnology. It includes integrated fabrication techniques using the SEM, such as e-beam and FIB, and it covers in-situ nanomanipulation of materials. The book is written by international experts from the top nano-research groups that specialize in nanomaterials characterization. The book will appeal to nanomaterials researchers, and to SEM development specialists.
Synthesis, Processing and Application of Micro and Nanostructured Materials
The book is focused on nanostructured materials, which have been well-studied in various fields from life to materials sciences. Nanostructured science has the potential to help make revolutionary discoveries based on modifying the properties of these materials compared with micro-structured materials. Nanostructured materials are the key to discovering new products based on new technologies. This book is focused on presenting new state-of-the-art methods for the synthesis and processing of nanostructured materials. These materials can be used in both in life and materials science with applications from biomedical devices, drug delivery systems, medical imaging with multiferoic materials, high-energy batteries, capacitors, superconductors, and aerospace components.
ISTFA 2012
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