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LED Packaging Technologies
Up-to-date practitioner's guide on LED packaging technologies, with application examples from relevant industries, historical insight, and outlook LED Packaging Technologies provides expert insight into current and future trends in LED packaging technologies, discussing the fundamentals of LED packaging technologies, from electrical contact design, thermal management and optical emission, and extraction, to manufacturing technologies, including the JEDEC testing standards, followed by accounts on the main applications of these LED packages in the automotive, consumer electronics, and lighting industries. LED Packaging Technologies includes information on: History of primitive lighting in hum...
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving it...
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Thermal Management for LED Applications
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
High Brightness Light Emitting Diodes
Volume 48in the Semiconductors and Semimetals series discusses the physics and chemistry of electronic materials, a subject of growing practical importance in the semiconductor devices industry. The contributors discuss the current state of knowledge and provide insight into future developments of this important field.
Tokyo Revengers 21
This is volume 21 of the latest time leap suspense manga!! The largest and last conflict in the history of Toman, the Kanto Incident, is over. Finally, Takemichi and Kisaki face off! It's time to eradicate all causes! Takemichi's battle that he absolutely cannot afford to lose begins now!!
Introduction to Solid-State Lighting
A thorough reference that sheds light on the promising field of solid-state lighting Solid-state lighting is a rapidly emerging field. Light Emitting Diodes are already used in traffic signals, signage/contour lighting, large area displays, and automotive applications. But its greatest future lies in the possibility of applying solid-state lamps to general lighting. Solid-state lighting promises to reduce energy consumption as much as fifty percent, cut down on carbon-dioxide emission, and even spur the development of a completely new lighting industry. Giving this important emerging field the attention it deserves, Introduction to Solid-State Lighting comprehensively covers: The history of lighting The characterization of visible light Conventional light sources LED basics Extraction of light from high-brightness LEDs White LED Applications of solid-state lamps
Chemically Deposited Nanocrystalline Metal Oxide Thin Films
This book guides beginners in the areas of thin film preparation, characterization, and device making, while providing insight into these areas for experts. As chemically deposited metal oxides are currently gaining attention in development of devices such as solar cells, supercapacitors, batteries, sensors, etc., the book illustrates how the chemical deposition route is emerging as a relatively inexpensive, simple, and convenient solution for large area deposition. The advancement in the nanostructured materials for the development of devices is fully discussed.
Solid State Lighting Reliability
Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to sub components is included as well as the integrated systems of SSL modules, lamps and luminaires including various failure modes, reliability testing and reliability performance. A follow-up, Solid State Lighting Reliability Part 2, was published in 2017.
My Happy Marriage, Vol. 1 (light novel)
IS THIS MARRIAGE A BLESSING? OR A CURSE? Born talentless to a noble family famous for their supernatural abilities, Miyo Saimori is forced into an existence of servitude by her abusive stepmother. When Miyo finally comes of marriageable age, though, her hopes of being whisked away to a better life crumble after she discovers her fiancé’s identity: Kiyoka Kudou, a commander apparently so cold and cruel that his previous would-be brides all fled within three days of their engagements. With no home to return to, Miyo resigns herself to her fate—and soon finds that her pale and beautiful husband-to-be is anything but the monster she expected. As they slowly open their hearts to each other, both realize the other may be their chance at finding true love and happiness.
