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Processing, Materials, and Integration of Damascene and 3D Interconnects
This issue focuses on recent advances in damascene interconnects and 3D interconnects.
The Last of the Whigs
The other two offers were in 1886, after Hartington had broken with Gladstone over Irish home rule and had led his Liberal Unionist supporters into an alliance with the Conservatives.
3D Microelectronic Packaging
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Handbook of Signal Processing Systems
It gives me immense pleasure to introduce this timely handbook to the research/- velopment communities in the ?eld of signal processing systems (SPS). This is the ?rst of its kind and represents state-of-the-arts coverage of research in this ?eld. The driving force behind information technologies (IT) hinges critically upon the major advances in both component integration and system integration. The major breakthrough for the former is undoubtedly the invention of IC in the 50’s by Jack S. Kilby, the Nobel Prize Laureate in Physics 2000. In an integrated circuit, all components were made of the same semiconductor material. Beginning with the pocket calculator in 1964, there have been many ...
Correspondance
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Design of 3D Integrated Circuits and Systems
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power di...
Gladstone
A new survey of Gladstone's life and career, placing him firmly in the context of nineteenth-century Britain, and covering both his intriguing private life and his public career.
3-Dimensional VLSI
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
