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Leaf Cell and Hierarchical Compaction Techniques
Leaf Cell and Hierarchical Compaction Techniques presents novel algorithms developed for the compaction of large layouts. These algorithms have been implemented as part of a system that has been used on many industrial designs. The focus of Leaf Cell and Hierarchical Compaction Techniques is three-fold. First, new ideas for compaction of leaf cells are presented. These cells can range from small transistor-level layouts to very large layouts generated by automatic Place and Route tools. Second, new approaches for hierarchical pitchmatching compaction are described and the concept of a Minimum Design is introduced. The system for hierarchical compaction is built on top of the leaf cell compac...
Research in Progress
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Three Dimensional System Integration
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Proceedings, Sixth IEEE Symposium on Parallel and Distributed Processing
The proceedings of the October 1994 symposium comprise 86 papers in sessions devoted to algorithms (three sessions), applications (three sessions), architecture, communications, distributed algorithms, distributed models, distributed systems (three sessions), fault tolerant systems, interconnection
Proceedings
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Handbook of 3D Integration, Volume 4
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
PARBASE-90, International Conference on Databases, Parallel Architectures, and Their Applications
Annotation Proceedings of the March 1990 meeting held in Miami Beach, Florida. Thirty-three full papers and 50 short papers were selected from almost 200. No index. Acidic paper. Annotation copyrighted by Book News, Inc., Portland, OR.
Design Automation, 29th
The proceedings of the conference held in Anaheim, California, June 1992, comprise 125 papers organized into 44 sessions. There is increased emphasis on presentations (short tutorials, panels, and selected papers) of interest to the design automation user community, with a better balance between the
