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Mechanics of Solder Alloy Interconnects
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Tensile Testing of Thin Films
Five technical papers covering the development of a set of techniques for measuring the tensile properties of thin films are gathered here. Also included are drawings of the mechanical components of the apparatus and listings of two computer programs. Additional necessary parts include a computer, instrumentation, two piezoelectric stacks, and an appropriate platform equipped with a microscope. Piezoelectric stacks are used as actuators. Noncontacting eddy-current displacement sensors measure both the tensile displacement and the force.Closed-loop feedback control allows a variety of test programs. The maximum available displacement is about 50 um, and the maximum available force is about 0.3 N. The resolution of displacement is about 25 nm, and the resolution of force is about 100 uN. Cyclic loading has been demonstrated for cycles as short as 20 s.
Applications of Experimental Mechanics to Electronic Packaging
Papers presented at the ASME International Mechanical Engineering Congress and Exposition.
Proceedings
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