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New Directions in Information Behaviour
New Research in Information Behaviour provides an understanding of the new directions, leading edge theories and models in information behaviour. Information behaviour is conceptualized as complex human information related processes that are embedded within an individual's everyday social and life processes.
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Superconductor
This book contains a collection of works intended to study theoretical and experimental aspects of superconductivity. Here you will find interesting reports on low-Tc superconductors (materials with Tc 30 K), as well as a great number of researches on high-Tc superconductors (materials with Tc 30 K). Certainly this book will be useful to encourage further experimental and theoretical researches in superconducting materials.
Recrystallization
Recrystallization shows selected results obtained during the last few years by scientists who work on recrystallization-related issues. These scientists offer their knowledge from the perspective of a range of scientific disciplines, such as geology and metallurgy. The authors emphasize that the progress in this particular field of science is possible today thanks to the coordinated action of many research groups that work in materials science, chemistry, physics, geology, and other sciences. Thus, it is possible to perform a comprehensive analysis of the scientific problem. The analysis starts from the selection of appropriate techniques and methods of characterization. It is then combined with the development of new tools in diagnostics, and it ends with modeling of phenomena.
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
Paper and Timber
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Structure Induced Anelasticity in Iron Intermetallic Compounds and Alloys
Different anelastic phenomena are discussed in this book with respect to iron-based binary and ternary alloys and intermetallic compounds of Fe3Me type, where Me are α-stabilizing elements Al, Ga, or Ge. An introduction into anelastic behavior of metallic materials is given, and methods of mechanical spectroscopy and neutron diffraction are introduced for the better understanding of structure-related relaxation and hysteretic phenomena. To characterize structure and phase transitions - both first and second order - in the studied alloys XRD, TEM, SEM, MFM, VSM, PAS, DSC techniques were used. Considerable emphasis is placed on in situ neutron diffraction tests that were performed with the sa...
Handbook of Silicon Based MEMS Materials and Technologies
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers ali...
