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Silicon-Organic Hybrid Platform for Photonic Integrated Circuits
We study the potential of the silicon-organic hybrid (SOH) platform for integrated optics. The unique properties of selected organic materials are added to silicon devices made with CMOS-based processes. We investigate the feasibility of this approach by making prototypes of key components in form of photonic integrated circuits: SOH lasers and SOH modulators are designed, fabricated, post-processed, and characterized. Application scenarios are identified.
High-Speed, Low-Power and Mid-IR Silicon Photonics Applications
In this book, the first high-speed silicon-organic hybrid (SOH) modulator is demonstrated by exploiting a highly-nonlinear polymer cladding and a silicon waveguide. By using a liquid crystal cladding instead, an ultra-low power phase shifter is obtained. A third type of device is proposed for achieving three-wave mixing on the silicon-organic hybrid (SOH) platform. Finally, new physical constants which describe the optical absorption in charge accumulation/inversion layers in silicon are determined.
Publications
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Photoptics 2015
The book provides a collection of selected papers presented to the third International Conference on Photonics, Optics and Laser Technology PHOTOPTICS 2015, covering the three main conference scientific areas of “Optics”, “Photonics” and “Lasers”. The selected papers, in two classes full and short, result from a double blind review carried out by the conference program committee members which are highly qualified experts in conference topic areas.
Plasmonic-Organic and Silicon-Organic Hybrid Modulators for High-Speed Signal Processing
High-speed electro-optic modulators in silicon platform are introduced and experimentally verified. The devices rely on plasmonic and photonic slot waveguides and are combined with efficient organic electro-optic materials. The bandwidth limitation of conventional silicon-organic-hybrid modulators is circumvented by capacitive coupling of the microwave signal. An advanced terahertz link that upconverts data directly from a 360 GHz carrier to an optical carrier is demonstrated for the first time.
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
Terabit-Rate Transmission Using Optical Frequency Comb Sources
Energy-efficient Tbit/s optical interconnects are key elements for future communication systems. Three novel optical frequency comb sources are investigated, which have the potential of being integrated in chip-scale Tbit/s transmitters. Such frequency combs provide a large number of carriers. The equidistance of the comb lines helps to minimize spectral guard bands. For each type of comb source, coherent data transmission experiments show the potential for Tbit/s data transmission rates.
